Thermal restriction matrix
Table 1. Label referenceThis table describes the label references used in the restriction tables.
Label
|
Description
|
STD
|
Standard
|
HPR
|
High performance
|
HSK
|
Heat sink
|
LP
|
Low profile
|
FH
|
Full height
|
DW
|
Double Wide (Xilinx FPGA accelerator)
|
BPS
|
Intel Persistent Memory 200 series (BPS)
|
Table 2. Processor and heat sink matrixThis table describes the processor and heat sink restriction matrix.
Heat sink
|
Processor TDP
|
2U HPR HSK
|
For all processor TDP
|
Table 3. Thermal restriction matrix
Configuration
|
Minimum
|
Typical
|
Maximum
|
Ambient temperature
|
Front GPU TDP
|
70 W SW x 4
|
250 W DW x 4
|
300 W DW x 4
|
Front drives
|
x1 SAS/SATA
|
x8 SAS/SATA
|
x8 NVMe
|
CPU TDP/cTDP
|
105 W
|
System Fan (60 x 76 mm) with 2U HPR HSK
|
35°C
|
120 W
|
|
135 W
|
|
150 W
|
|
165 W
|
|
185 W
|
|
205 W
|
|
220 W
|
|
230 W
|
|
240 W
|
|
250 W
|
|
265 W
|
|
270 W
|
|
NOTE Six System fans (60 x 76 mm) are required for all the configurations.
NOTE T4 GPU card is supported on riser 2 (R2a slot 3/6) with maximum power loading.
NOTE Xeon(R) 8368Q supports only processor liquid cooling.
NOTE Only ASHRAE A2 category ambient temperature is supported.
NOTE For all memory configuration only System fan (60 x 76 mm) with 2U HPR HSK is used.
NOTE BPS DIMMs supported only at 30°C ambient temperature.
NOTE 128 GB LRDIMM, 64 GB RDIMM, 32 GB RDIMM, 16 GB RDIMM and 8 GB RDIMM supports at 35°C ambient temperature.