Dell XC Core Support Matrix XC450, XC650, XC750, XC750xa, XC6520, XC7525, XC4000r, XC4510c, XC4520c, and XC4000z Core

XC750 technical specifications

Specifications for the components of the XC750 are provided.

The following XC750 specifications are provided:

Chassis dimensions
Weight
Processor
Power supply units
Supported operating systems
Cooling fans
System battery
Expansion card risers
Memory
Storage controller
Disk drives
USB ports
NIC ports
Serial ports
VGA ports
Video
Environment
Particulate and gaseous contamination
Thermal restrictions

Chassis dimensions

The following table provides the chassis dimensions for the XC Core XC750:

Table 1. Chassis dimensionsChassis dimensions.
Drives	Xa	Xb	Y	Za	Zb	Zc
0/8/12/16/24 drives	482 mm (18.97 in)	434 mm (17.08 in)	86.8 mm (3.41 in)	35.84 mm (1.4 in) with bezel 22 mm (0.86 in) without bezel	700.7 mm (27.58 in) Ear to rear wall	736.29 mm (28.92 in) Ear to PSU handle

Zb is the nominal rear wall external surface where the XC Core XC750 board I/O connectors reside.

Chassis weight

The following table provides the XC Core XC750 weight specifications:

Table 2. Chassis weight specificationsChassis weight specifications.
System configuration	Maximum weight (with all drives/SSDs)
12 x 3.5-inch	35.3 kg (77.82 lb)
16 x 2.5-inch	32.6 kg (71.87 lb)
24 x 2.5-inch	35.2 kg (77.60 lb)

Processor specifications

The following table provides processor specifications for the XC Core XC750.

Table 3. Processor specificationsProcessor specifications.
Supported processor	Number of processors supported
Third-generation Intel Xeon Scalable processors with up to 40 cores	Two

PSU specifications

The XC Core XC750 supports up to two AC or DC power supply units (PSUs).

WARNING: Instructions for the qualified electricians only:

System using -(48-60) V DC or 240 V DC power supplies are intended for restricted access locations. See Articles 110-5, 110-6, 110-11, 110-14, and 110-17 of the National Electrical Code, American National Standards Institute (ANSI)/National Fire Protection Association (NFPA) 70.

If applicable in the country or region of use, 240 V DC power supplies shall be connected to the 240 V DC outlet from certified power distribution units.

Power supply cords and jumper cords and the associated plugs, inlets, and connectors shall have appropriate electrical ratings. The rating shall reference the rating label on the system when used for connection.

Table 4. PSU specificationsPSU specifications.
PSU	Class	Heat dissipation (maximum BTU/hr)	Frequency (Hz)	Voltage	AC					Current
					High line 200–240 V			Low line 100–120 V
					Peak Power	-		Peak Power	-
					-72 VDC	-72 VDC	240 VDC	-40 VDC	40 VDC
800 W AC	Platinum	3139	50/60	100–240 V	1360 W	800 W	800 W	1360 W	800 W	9.2 - 4.7 A
800 W Mixed mode	N/A	3139	N/A	240 V	1360 W	800 W	800 W	1360 W	800 W	3.8 A
1100 W AC	Titanium	4299	50/60 Hz	100-240 V	1870 W	1100 W	1100 W	1785 W	1050 W	12 - 6.3 A
1100 W Mixed mode	N/A	4299	N/A	240 VAC	1870 W	1100 W	1100 W	1785 W	1050 W	5.2 A
1100 W DC	N/A	4265	N/A	-48 –(-60) V	1870 W	1100 W	N/A	1870 W	1100 W	27.0 A
1400 W AC	Platinum	5459	50/60 Hz	100-240 V	2380 W	1400 W	1400 W	1785 W	1050 W	12–8 A
1400 W Mixed mode	N/A	5459	N/A	240 V	2380 W	1400 W	1400 W	1785 W	1050 W	6.6 A

Supported operating systems

The XC Core XC750 supports the following operating systems:

Windows Server with Hyper-V (XC750-14 only)
VMware ESXi
AHV

For more information, go to Dell | Server Operating System Support.

Cooling options

Maintain optimum thermal performance on the XC Core XC750 using various cooling components based on the following:

CPU TDP
Storage modules and rear drives
GPU
Persistent memory.

The Dell XC Core XC750 offers air cooling.

Cooling fan specifications

The Dell XC Core XC750 supports up to six standard (STD), high-performance silver grade (HPR SLVR), or high-performance gold grade (HPR GOLD) cooling fans.

The following table provides the specifications for the fans that are used in the XC Core XC750:

Table 5. Cooling fan specificationsCooling fan specifications
Fan type	Abbreviation	Also known as	Label color	Label image
Standard fan	STD	STD	No label	Standard fan
High performance (Silver grade) fan	HPR (SLVR)	HPR	Silver	New cooling fans come with the High Performance Silver Grade label. The older cooling fans have the High Performance label. High performance (Silver grade) fan
High performance (Gold grade) fan	HPR (Gold)	VHP - Very High Performance	Gold	New cooling fans come with the High Performance Gold Grade label. The older cooling fans have the High Performance label. High performance fan High performance (Gold grade) fan

Mixing of STD, HPR SLVR, or HPR GOLD fan is not supported.

The STD, HPR SLVR, or HPR GOLD fan installation depends on the XC Core XC750 configuration. For more information about the supported fan configuration or matrix, see Thermal restriction matrix.

System battery specifications

The XC Core XC750 supports CR 2032 3.0-V lithium coin cell system battery.

Expansion card riser specifications

The XC Core XC750 supports up to three slots and all PCI express (PCIe) Gen 4 expansion cards.

Table 6. Expansion card riser specificationsExpansion card riser specifications.
PCIe slot	With Regular shroud	With GPGPU shroud	R1a	R1b	R1c	R2a	R2b	R3a	R3b	R4a	Rb
Slot 1	Full height Half length	Full height Full length	-	x8	x16 (single-width (SW) GPU)	-	-	-	-	-	-
Slot 2	Full height Half length	Full height Full length	x16 (double- width (DW) GPU)	x8	x16 (SW GPU)	-	-	-	-	-	-
Slot 3	Low profile Half length	Low profile Half length	N/A	-	-	x16	-	-	-	-	-
Slot 3 SNAPI	Low profile Half length	Low profile Half length	-	-	-	-	x16	-	-	-	-
Slot 4	Full height Half length	N/A	-	-	-	-	-	-	x8	-	-
Slot 5	Full height Half length	Full height Half length	-	-	-	-	-	x16	x8	-	-
Slot 6	Low profile Half length	Low profile Half length	-	-	-	x16	x8	-	-	-	-
Slot 7	Full height Half length	Full height Full length	-	-	-	-	-	-	-	x16 (DW GPU	x8
Slot 8	Full height Half length	N/A	-	-	-	-	-	-	-	-	x8

WARNING:Do not install or use a consumer-grade GPU in the Enterprise Server products.

Memory specifications

The XC Core XC750 supports the following memory specifications for optimized operation:

Table 7. Memory specificationsMemory specifications.
DIMM type	DIMM rank	DIMM capacity	Single processor		Dual processor
DIMM type	DIMM rank	DIMM capacity	Minimum RAM	Maximum RAM	Minimum RAM	Maximum RAM
RDIMM	Single rank	8 GB	8 GB	128 GB	16 GB	256 GB
	Dual rank	16 GB	16 GB	256 GB	32 GB	512 GB
		32 GB	32 GB	512 GB	64 GB	1 TB
		64 GB	64 GB	1 TB	128 GB	2 TB
LRDIMM	Quad rank	128 GB	128 GB	2 TB	256 GB	4 TB
LRDIMM	Octa rank	256 GB	256 GB	4 TB	512 GB	8 TB

The following table describes the memory module socket specifications:

Table 8. Memory module socket specificationsMemory module socket specifications.
Memory module sockets	Speed
32, 288-pin	3200 MT/s, 2933 MT/s

Storage controller specifications

The XC Core XC750 supports the storage controller card in the following table:

Table 9. Storage controller specificationsStorage controller specifications.
Internal controllers
HBA355I Boot Optimized Storage Subsystem (BOSS-S2): HW RAID 2 x M.2 SSDs 240 GB or 480 GB Boot Optimized Storage Subsystem (BOSS-S1): HW RAID 2 x M.2 SSDs 240 GB or 480 GB

The software RAID S150 is supported on either of the following:

SATA drives with chipset SATA only backplane
NVMe drives in universal slots with processor direct PCIe cable connected backplane

Disk drive specifications

The XC Core XC750 supports the following disk drives:

12 x 3.5-inch hot-swappable SAS or SATA drives
24 x 2.5-inch hot-swappable SAS, SATA, or NVMe drives
2 x 2.5-inch rear hot-swappable SAS, SATA, or NVMe drives
16 x 2.5-inch hot-swappable NVMe drives

For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support (Browse all Products > Infrastructure > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Select this product > Documentation > Manuals and Documents).

USB ports specifications

The following table provides specifications for the XC Core XC750 USB ports:

Table 10. USB ports specificationsUSB ports specifications.
Front	Front	Rear	Rear	Internal (Optional)	Internal (Optional)
USB port type	No. of ports	USB port type	No. of ports	USB port type	No. of ports
USB 2.0-compliant port	One	USB 2.0-compliant port	One	Internal USB 3.0-compliant port	One
Micro-USB, iDRAC Direct	One	USB 3.0-compliant port	One	Internal USB 3.0-compliant port	One

The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

The USB 2.0 specifications provide a 5 V supply on a single wire to power connected USB devices. A unit load is defined as 100 mA in USB 2.0, and 150 mA in USB 3.0. A device may draw a maximum of five unit loads (500 mA) from a port in USB 2.0; 6 (900 mA) in USB 3.0.

The USB 2.0 interface can provide power to low-power peripherals but must adhere to USB specification. An external power source is required for higher-power peripherals to function, such as external CD or DVD drives.

NIC port specifications

The XC Core XC750 supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports. The ports are embedded on the LAN on Motherboard (LOM) and integrated on the optional OCP cards.

Table 11. NIC port specificationsNIC port specifications.
Feature	Specifications
LOM card	1 GB x 2
OCP card (OCP 3.0)	10 GbE x 2, 10 x GbE x 4, 25 GbE x 2, 25 GbE x 4

Serial connector specifications

The XC Core XC750 supports one optional card type serial connector, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant .

The optional serial connector card is installed similar to an expansion card filler bracket.

VGA ports specifications

The Dell XC Core XC750 supports One DB-15 VGA port one each on the front and back (optional for liquid cooling) panels.

Video specifications

The XC Core XC750 supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer. The following table describes the supported video resolutions:

Table 12. Video specificationsVideo specifications.
Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, see the product environmental datasheet that is located with the Manuals & Documents on Dell Support.

The following table provides information for operational climatic range, category A2:

Table 13. Environmental specificationsEnvironmental specifications.
Temperature	Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2,953 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent ranges (noncondensing always)	Minimum: 8% RH with -12°C (10.4°F) dew point Maximum: 80% RH with 21°C (69.8°F) dew point
Operational altitude derating	Reduce the maximum temperature by 1°C/300 m (1.8°F/984 ft) above 900 m (2953 ft)

The following table provides information for operational climatic range, category A3:

Table 14. Operational climatic range, category A3Operational climatic range, category A3.
Temperature	Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft)	5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent ranges (noncondensing always)	Minimum: 8% RH with -12°C (10.4°F) dew point Maximum: 85% RH with 24°C (75.2°F) dew point
Operational altitude derating	Reduce the maximum temperature by 1°C/175 m (33.8°F/574 ft) above 900 m (2953 ft)

The following table provides information for operational climatic range, category A4:

Table 15. Operational climatic range, category A4Operational climatic range, category A4.
Temperature	Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft)	5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent ranges (noncondensing always)	Minimum: 8% RH with -12°C (10.4°F) dew point Maximum: 90% RH with 24°C (75.2°F) dew point
Operational altitude derating	Reduce the maximum temperature by 1°C/125 m (33.8°F/410 ft) above 900 m (2953 ft)

The following table provides information for shared requirements across all categories:

Table 16. Shared requirementsShared requirements.
Temperature	Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and nonoperation)	20°C (36°F) in an hour* and 5°C (9°F) in 15 minutes For tape: 5°C (9°F) in an hour* NOTE:Per ASHRAE thermal guidelines for tape hardware these rates are not instantaneous.
Nonoperational temperature limits	-40°C to 65°C (-40°F to 149°F)
Nonoperational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum nonoperational altitude	12,000 meters (39,370 ft)
Maximum operational altitude	3,048 meters (10,000 ft)

The following table specifies the maximum allowed vibration:

Table 17. Maximum allowed vibrationMaximum allowed vibration.
Maximum vibration	Specifications
Operating	0.26 G_rms at 5 Hz to 350 Hz (all operation orientations)
Storage	1.88 G_rms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

The following table specifies the shock pulse maxima:

Table 18. Shock pulse maximaShock pulse maxima.
Maximum shock pulse	Specifications
Operating	Six consecutive shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 milliseconds
Storage	Six consecutive shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 milliseconds

Thermal restriction matrix

The following table describes label references:

Table 19. Thermal restriction matrixThermal restriction matrix.
Label	Explanation
STD	Standard
HPR	High Performance
HSK	Heat sink
LP	Low Profile (Riser)
FH	Full Height (Riser)
DW	Double Wide (Xilinx FPGA accelerator)

The following table provides the processor and heat sink matrix:

Table 20. Processor and heat sink matrixProcessor and heat sink matrix.
Heat sink	Processor TDP
1U STD HSK	<= 165 W (for non-GPU)
T-Type HSK	For all TDP with GPU, and 256 GB LRDIMM configurations
2U HPR HSK	>165 W (for non-GPU configurations)

The following table provides the thermal restriction matrix with <= 64 GB RDIMM (non-GPU)

Table 21. Thermal restriction matrix with <= 64 GB RDIMMThermal restriction matrix with <= 64 GB RDIMM.
Configuration		24 x 2.5-inch SAS or SATA			16 x 2.5-inch SAS + 8 x 2.5-inch NVMe	12 x 3.5-inch SAS or SATA	-	-	Ambient temperature
Rear storage		No Rear Drives	2 x Rear 2.5-inch, no rear fan	4 x Rear 2.5-inch with fan	No Rear Drives	No Rear Drives	2 x Rear 2.5-inch, no rear fan	4 x Rear 2.5-inch with fan	-
CPU TDP or cTDP	105 W	-	HPR SLVR fan		STD fan	HPR SLVR fan		HPR SLVR fan	35°C (95°F)
	120 W								35°C (95°F)
	125 W								35°C (95°F)
	135 W								35°C (95°F)
	140 W								35°C (95°F)
	150 W								35°C (95°F)
	165 W								35°C (95°F)
	185 W				HPR SLVR fan				35°C (95°F)
	195 W								35°C (95°F)
	205 W		HPR Gold fan						35°C (95°F)
	225 W								35°C (95°F)
	230 W							HPR SLVR fan *	30°C (86°F)
	235 W								30°C (86°F)
	240 W								30°C (86°F)
	250 W								30°C (86°F)
	265 W	-				HPR SLVR fan			30°C (86°F)
	270 W	-				HPR SLVR fan			30°C (86°F)

* Supported ambient temperature is 30°C (86°F).

The following table provides the thermal restriction matrix with 128 GB LRDIMM (Non-GPU).

Table 22. Thermal restriction matrix with 128 GB LRDIMMThermal restriction matrix with 128 GB LRDIMM.
Configuration		8 x 2.5-inch NVMe	16 x 2.5-inch SAS or SATA	16 x 2.5-inch NVMe	24 x 2.5-inch SAS or SATA			16 x 2.5-inch SAS + 8 x 2.5-inch NVMe	24 x 2.5-inch NVMe	12 x 3.5-inch SAS or SATA	-	-	Ambient temperature
Rear storage		No Rear Drives	No Rear Drives	No Rear Drives	No Rear Drives	2 x Rear 2.5-inch, no rear fan	4 x Rear 2.5-inch with fan	No Rear Drives	No Rear Drives	No Rear Drives	2 x Rear 2.5-inch, no rear fan	4 x Rear 2.5-inch with fan	-
CPU TDP or cTDP	105 W	STD fan		HPR SLVR fan		HPR SLVR fan		HPR SLVR fan	HPR Gold fan	HPR SLVR fan		HPR SLVR fan *	35°C (95°F)
-	120 W												35°C (95°F)
-	125 W												35°C (95°F)
-	135 W												35°C (95°F)
-	140 W												35°C (95°F)
-	150 W												35°C (95°F)
-	165 W												35°C (95°F)
-	185 W												30°C (86°F)
-	195 W												30°C (86°F)
-	205 W					HPR Gold fan							30°C (86°F)
-	225 W											Not supported	30°C (86°F)
-	230 W												30°C (86°F)
-	235 W												30°C (86°F)
-	240 W												30°C (86°F)
-	250 W												30°C (86°F)
-	265 W	STD fan	HPR SLVR fan							Not supported			30°C (86°F)
-	270 W	STD fan	HPR SLVR fan							Not supported			30°C (86°F)

* Supported ambient temperature is 30°C (86°F).

The following table provides the thermal restriction matrix with 256 GB LRDIMM (Non-GPU)

Table 23. Thermal restriction matrix with 256 GB LRDIMMThermal restriction matrix with 256 GB LRDIMM.
Configuration		8 x 2.5-inch NVMe	16 x 2.5-inch SAS or SATA	16 x 2.5-inch NVMe	24 x 2.5-inch SAS/ SATA			16 x 2.5-inch SAS + 8 x 2.5-inch NVMe	24 x 2.5-inch NVMe	12 x 3.5-inch SAS or SATA	-	-	Ambient temperature
Rear storage		No Rear Drives	No Rear Drives	No Rear Drives	No Rear Drives	2 x Rear 2.5-inch, no rear fan	4 x Rear 2.5-inch with fan	No Rear Drives	No Rear Drives	No Rear Drives	2 x Rear 2.5-inch, no rear fan	4 x Rear 2.5-inch with fan	-
CPU TDP or cTDP	105 W	1DPC / 2 DPC HPR			1DPC				1DPC	Not supported			35°C (95°F)
-	120 W												35°C (95°F)
-	125 W												35°C (95°F)
-	135 W												35°C (95°F)
-	140 W												35°C (95°F)
-	150 W												35°C (95°F)
-	165 W												35°C (95°F)
-	185 W												30°C (86°F)
-	195 W												30°C (86°F)
-	205 W												30°C (86°F)
-	225 W												30°C (86°F)
-	230 W												30°C (86°F)
-	235 W												30°C (86°F)
-	240 W												30°C (86°F)
-	250 W												30°C (86°F)
-	265 W												30°C (86°F)
-	270 W												30°C (86°F)

For all CPU TDP (105 W- 270 W) request HPR GOLD fan, T-Type HSK and processor HSK blank for 2.5-inch configurations.

For CPU TDP >165 W and riser configuration 1, 2, 3, or 4 supports maximum of four PCIe cards in Riser 1 or 2. This restriction is applicable for 8 x 2.5-inch NVMe, 16 x 2.5-inch SAS or SATA and 16 x 2.5-inch NVMe system configurations.

The following table provides the thermal restriction with <=128 GB DIMM (GPU):

Table 24. Thermal restrictionThermal restriction.
Configuration (Front storage)	Fan type	CPU TDP or cTDP	GPU (Ambient temperature)
Configuration (Front storage)	Fan type	CPU TDP or cTDP	A100 (80G)	A100	A40 (max 2)	A30	A10	M10 (max 2)	T4 (max 6)
24 x 2.5-inch SAS	HPR GOLD fan	270 W	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	30°C (86°F)
16 x 2.5-inch SAS + 8 x 2.5-inch NVMe	HPR SLVR fan	270 W	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	35°C (95°F)	30°C (86°F)

GPU cards are not supported in 12 x 3.5-inch drive and rear drive configuration systems.

All GPU cards require 1U T-type HSK and GPU shroud.

T4 GPU is not supported on riser 2 in 8 x 3.5-inch configuration.

Other restrictions for air cooling configurations

Kioxia CM6/CD6 NVMeSSD are not supported on rear drive module.
Samsung 1733v2/1735v2 NVMeSSD are not supported on 12 x 3.5-inch rear drive module.
ICX XCC Platinum 8368Q 270W-38C CPU in air cooling system is not supported.
25 Gb and above PCIe or OCP cards require high temperature (85°C (185°F)) active optics cable.
Requires 2U-HPR HSK(8F34X) to support "ICX HCC Gold 6334 165W-8C CPU" in non-GPU configuration.
Requires HPR GOLD fan to support BOSS-S1 on 2.5-inch configuration and not supported on 3.5-inch configuration.

Shroud, heat sink, and riser cage restriction

The following table provides the restrictions with shroud, heat sink, and riser cage:

Table 25. PCIe card typePCIe card type.
PCIe card type	Form factor	Fan	Processor heat sink	Shroud	Riser cage
GPU	FL	Configuration dependency	T-type (1U-EXT)	GPU shroud	long
-	HL				short
Non-GPU	FL				long
-					short
-					long
-	HL		1U-STD or 2U-HPR	STD shroud	short

Thermal air restrictions

ASHRAE A3 environment for air cooling configuration

Two PSUs are required in redundant mode. If there is PSU failure, system performance may be reduced.
PCIe SSD is not supported.
BPS, 128 GB, or greater capacity DIMMs are not supported.
GPU and FPGA are not supported.
Processor TDP greater than 165 W are not supported.
HPR SLVR fans are required.
Front storage is not supported in 12 x 3.5-inch SAS configuration.
Rear drives are not supported.
Non-Dell qualified peripheral cards and peripheral cards greater than 25 W are not supported.
OCP 3.0 card is supported with 85°C (185°F) active optic cable.
BOSS 1.5 card is supported.

ASHRAE A4 environment for air cooling configuration

Two PSUs are required in redundant mode. If there is PSU failure, system performance may be reduced.
PCIe SSD is not supported.
BPS, 128 GB, or greater capacity DIMMs are not supported.
GPU and FPGA are not supported.
Processor TDP greater than 120 W are not supported.
HPR SLVR fans are required.
Front storage is not supported in 12 x 3.5-inch SAS configuration.
Rear drives are not supported.
BOSS 1.5 is not supported.
OCP 3.0 card is supported with 85°C (185°F) active optic cable and cards tier ?4.
Non-Dell qualified peripheral cards and peripheral cards greater than 25 W are not supported.

Particulate and gaseous contamination specifications

If the levels of particulate or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer. The following table defines the limitations that help avoid any equipment damage or failure from particulate and gaseous contamination:

Table 26. Particulate contamination specificationsParticulate contamination specifications.
Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. The ISO Class 8 condition applies to data center environments only. This air filtration requirement does not apply to IT equipment designed to be used outside a data center. For example, the requirement does not apply in environments such as an office or factory floor. Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles. This condition applies to data center and nondata center environments.
Corrosive dust	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. This condition applies to data center and nondata center environments.

The following table provides the gaseous contamination specifications:

Table 27. Gaseous contamination specificationsGaseous contamination specifications.
Gaseous contamination	Specifications
Copper coupon corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013.
Silver coupon corrosion rate	<200 Å/month as defined by ANSI/ISA71.04-2013.

Welcome

Welcome to Dell