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Dell XC Core Support Matrix XC450, XC650, XC750, XC750xa, XC6520, XC7525, XC4000r, XC4510c, XC4520c, and XC4000z Core

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XC750xa technical specifications

Specifications for the components of the XC750xa are provided.

The following XC750xa specifications are provided:

  • Chassis dimensions
  • Weight
  • Processor
  • Power supply units
  • Supported operating systems
  • Cooling fans
  • System battery
  • Expansion card risers
  • Memory
  • Storage controller
  • Disk drives
  • USB ports
  • NIC ports
  • Serial ports
  • VGA ports
  • Video
  • Environment
  • Particulate and gaseous contamination
  • Thermal restrictions

Chassis dimensions

Figure 1. Chassis dimensions
Chassis dimensions

The following table provides the chassis dimensions for the XC Core XC750xa:

Table 1. Chassis dimensions for the XC Core XC750xaChassis dimensions for the XC Core XC750xa
Drives Xa Xb Y Za Zb Zc
Eight drives 482 mm (18.97 in) 434 mm (17.08 in) 86.8 mm (3.41 in) 35.84 mm (1.4 in) with bezel

22 mm (0.86 in) without bezel 		837.2 mm (32.96 in)

Ear to rear wall 		872.8 mm (34.36 in)

Ear to PSU handle

Zb is the nominal rear wall external surface where the system board I/O connectors reside.

Chassis weight

The following table provides the XC Core XC750xa weight specifications:

Table 2. Chassis weightChassis weight
System configuration Maximum weight (with all drives/SSDs)
8 x 2.5-inch + 4 x DW-FL cards (front) + 4 x PCIe cards (rear) 34.9 kg (76.94 lb)

Processor specifications

The XC Core XC750xa supports two 3rd Generation Intel Xeon Scalable processors with up to 40 cores.

PSU specifications

The XC Core XC750xa supports up to two AC or DC power supply units (PSUs).

WARNING:Instructions for the qualified electricians only:

Systems using -(48-60) V DC or 240 V DC power supplies are intended for restricted access locations. See Articles 110-5, 110-6, 110-11, 110-14, and 110-17 of the National Electrical Code, American National Standards Institute (ANSI)/National Fire Protection Association (NFPA) 70. If applicable in the country or region of use, 240 V DC power supplies shall be connected to the 240 V DC outlet from certified power distribution units.

Power supply cords and jumper cords and the associated plugs, inlets, and connectors shall have appropriate electrical ratings. The ratings shall reference the rating label on the system when used for connection.

The following table provides PSU specifications for the XC Core XC750xa:

Table 3. PSU specificationsPSU specifications
PSU Class Heat dissipation (maximum) Frequency Voltage Peak power N/A N/A Peak Power N/A Current
High line/-72 VDC High line/-72 VDC High line 240 VDC Low line/-40 VDC Low line/-40 VDC
1400 W AC Platinum 5459 BTU/hr 50/60 Hz 100–240 V 2380 W 1400 W 1400 W 1785 W 1050 W 12–8 A
1400 W Mixed Mode HVDC (for China only) N/A 5459 BTU/hr N/A 240 V 2380 W 1400 W 1400 W 1785 W 1050 W 6.6 A
2400 W AC Platinum 9213 BTU/hr 50/60 Hz 100–240 V 4080 W 2400 W 2400 W 2380 W 1400 W 16–13.5 A
2400 W Mixed Mode HVDC (for China only) N/A 9213 BTU/hr N/A 240 V 2380 W 1400 W 1400 W 1785 W 1050 W 11.2 A

Supported operating systems

The XC Core XC750xa supports the following operating systems:

  • VMware ESXi
  • AHV

For more information, go to Dell | Server Operating System Support.

Cooling fan specifications

Cooling options

Maintain optimum thermal performance using cooling components that are based on the following:

  • Processor TDP
  • Storage modules
  • Graphical processing unit (GPU)
  • Persistent memory

The XC Core XC750xa uses air cooling.

Cooling fan specifications

The XC Core XC750xa supports up to six cooling fans. The following table provides details:

Table 4. Cooling fan specificationsCooling fan specifications
Fan type Abbreviation Also known as Label color Label image
High performance GOLD fan HPR GOLD VHP - Very High Performance Gold New cooling fans come with the High-Performance Gold Grade label. The older cooling fans have the High-Performance label.

High-Performance Gold Grade label

Very high performance fan

System battery specifications

The XC Core XC750xa supports the CR 2032 3.0-V lithium coin cell system battery.

Expansion card riser specifications

The XC Core XC750xa supports up to four full height, or eight low profile riser slots with PCI express (PCIe) Gen 4 expansion cards.

The following table describes the supported expansion card slots on the XC Core XC750xa system board:

Table 5. Expansion card riser specificationsExpansion card riser specifications
PCIe slot With GPGPU shroud GPU riser module right with R1 paddle card R2a (Riser 2) GPU riser module left with R4 paddle card
Slot 3 Low profile

Half length 		- x16 -
Slot 4 Full height

Half length 		- - -
Slot 5 Full height

Half length 		- - -
Slot 6 Low profile

Half length 		- x16 -
Slot 31 Single width/ Dual width

Full height-Full length(with Dell custom bracket) 		- - x16
Slot 32 Single width/ Dual width

Full height-Full length(with Dell custom bracket) 		- - x16
Slot 33 Single width/ Dual width

Full height-Full length(with Dell custom bracket) 		x16 - -
Slot 34 Single width/ Dual width

Full height-Full length(with Dell custom bracket) 		x16 - -

Memory specifications

The XC Core XC750xa supports the following memory specifications for optimized operation.

Table 6. Memory specificationsMemory specifications
DIMM type DIMM rank DIMM capacity Single processor Dual processor
Minimum RAM Maximum RAM Minimum RAM Maximum RAM
RDIMM Single rank 8 GB 8 GB 128 GB 16 GB 256 GB
Dual rank 16 GB 16 GB 256 GB 32 GB 512 GB
32 GB 32 GB 512 GB 64 GB 1 TB
64 GB 64 GB 1 TB 128 GB 2 TB
LRDIMM Quad rank 128 GB 128 GB 2 TB 256 GB 4 TB

8 GB RDIMM is not supported with Intel Persistent Memory 200 series (BPS).

Storage controller specifications

The XC Core XC750xa supports the following storage controller cards:

  • HBA355I
  • Boot Optimized Storage Subsystem (BOSS-S2): HWRAID 2 x M.2 SSDs 240 GB or 480 GB
  • Boot Optimized Storage Subsystem (BOSS-S1): HWRAID 2 x M.2 SSDs 240 GB or 480 GB

Disk drive specifications

The XC Core XC750xa supports 8 x 2.5-inch hot-swappable SAS, SATA drives, or NVMe drives.

For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support (Browse all Products > Infrastructure > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Select this product > Documentation > Manuals and Documents).

USB ports specifications

The XC Core XC750xa supports the USB port types that are described in the following table:

Table 7. USB ports specificationsUSB ports specifications
Front Front Rear Rear Internal (Optional) Internal (Optional)
USB port type No. of ports USB port type No. of ports USB port type No. of ports
USB 2.0-compliant port One USB 2.0-compliant port One Internal USB 3.0-compliant port One
Micro-USB 2.0, iDRAC Direct One USB 3.0-compliant ports One - -

The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

The USB 2.0 specifications provide a 5 V supply on a single wire to power connected USB devices. A unit load is defined as 100 mA in USB 2.0, and 150 mA in USB 3.0. A device may draw a maximum of five unit loads (500 mA) from a port in USB 2.0; 6 (900 mA) in USB 3.0.

The USB 2.0 interface can provide power to low-power peripherals but must adhere to USB specification. An external power source is required for higher-power peripherals to function, such as external CD or DVD drives.

NIC ports specifications

The XC Core XC750xa supports up to two Network Interface Controller (NIC) ports. The ports are embedded on the LAN on the Motherboard (LOM) and integrated on the optional OCP cards. Details are provided in the following table:

Table 8. NIC ports specificationsNIC ports specifications
Feature Specifications
LOM card 1 GbE x 2
OCP card (OCP 3.0) 10 GbE x 2, 10 GbE x 4, 25 GbE x 2, 25 GbE x 4

Serial connector specifications

The XC Core XC750xa supports one optional card type serial connector, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant .

The optional serial connector card is installed similar to an expansion card filler bracket.

VGA port specifications

The XC Core XC750xa supports one DB-15 VGA.

Video specifications

The XC Core XC750xa supports an integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

The following table describes the supported video resolutions:

Table 9. Supported video resolutionsSupported video resolutions
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, see the product environmental datasheet that is located with the Manuals & Documents on Dell Support.

The following table provides specifications for operational climatic range, category A2:

Table 10. Operational climatic range specifications, category A2Operational climatic range specifications, category A2
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes <900 m (<2953 ft) 10–-35°C (50–-95°F) with no direct sunlight on the equipment
Humidity percent ranges (noncondensing always) Minimum: 8% RH with -12°C (53.6°F) dew point

Maximum: 80% RH with 21°C (69.8°F) dew point
Operational altitude derating Reduce the maximum temperature by 1°C/300 m (33.8°F/984 ft) above 900 m (2953 ft).

The following table provides specifications for operational climatic range, category A3:

Table 11. Operational climatic range specifications, category A3Operational climatic range specifications, category A3
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes <900 m (< 2953 ft) 5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent ranges (noncondensing always) Minimum: 8% RH with -12°C (10.4°F) dew point

Maximum: 85% RH with 24°C (75.2°F) dew point
Operational altitude derating Reduce the maximum temperature by 1°C/175 m (33.8°F/574 ft) above 900 m (2953 ft) .

The following table provides specifications for operational climatic range category A4:

Table 12. Operational climatic range specifications, category A4Operational climatic range specifications, category A4
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes <900 m (<2953 ft) 5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent ranges (noncondensing always) Minimum: 8% RH with -12°C (10.4°F) dew point

Maximum: 90% RH with 24°C (75.2°F) dew point
Operational altitude derating Reduce the maximum temperature by 1°C/125 m (33.8°F/410 ft) above 900 m (2953 ft).

The following table provides specifications for shared requirements across all categories:

Table 13. Shared requirementsShared requirements.
Temperature Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and nonoperation) 20°C (36°F) in an hour* and 5°C (9°F) in 15 minutes

For tape: 5°C (9°F) in an hour* (9°F in an hour)
NOTE:Per ASHRAE thermal guidelines for tape hardware these rates are not instantaneous temperature changes.
Nonoperational temperature limits -40°C to 65°C (-104°F to 149°F)
Nonoperational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum nonoperational altitude 12,000 m (39,370 ft)
Maximum operational altitude 3,048 meters (10,000 ft)

The following table provides the maximum vibration specifications:

Table 14. Maximum vibration specificationsMaximum vibration specifications
Maximum vibration Specifications
Operating 0.21 Grms at 5 Hz to 500 Hz for 10 minutes (all operation orientations)
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

The following table provides the maximum shock pulse specifications:

Table 15. Maximum shock pulse specificationsMaximum shock pulse specifications.
Maximum shock pulse Specifications
Operating Six consecutive shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 milliseconds.
Storage Six consecutive shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 milliseconds.

The following table describes label references:

Table 16. Label referencesLabel references.
Label Explanation
STD Standard
HPR High Performance
HSK Heat sink
LP Low Profile (Riser)
FH Full Height (Riser)
DW Double Wide (Xilinx FPGA accelerator)

The following table provides the processor and heat sink matrix:

Table 17. Processor and heat sink matrixProcessor and heat sink matrix.
Heat sink Processor TDP
2U HPR HSK For all processor TDP

The following table provides the thermal restriction matrix:

Table 18. Thermal restriction matrixThermal restriction matrix.
Configuration Minimum Typical Maximum Ambient temperature
Front GPU TDP 70 W SW x 4 250 W DW x 4 300 W DW x 4
Front drives x1 SAS or SATA x8 SAS or SATA x8 NVMe
CPU TDP/ cTDP 105 W HPR GOLD fan with 2U HPR HSK 35°C (95°F)
120 W
135 W
150 W
165 W
185 W
205 W
220 W
250 W
270 W

Six fans are required for all the configurations.

T4 GPU card is supported on riser 2 (R2a slot 3/6) with maximum power loading.

Only ASHRAE A2 category ambient temperature is supported.

For all memory configurations, only HPR GOLD fan with 2U HPR HSK is used.

128 GB LRDIMM, 64 GB RDIMM, 32 GB RDIMM, and 16 GB RDIMM support at 35°C (95°F) ambient temperature.

Particulate and gaseous contamination specifications

If the levels of particulate or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer. The following table defines the limitations that help avoid any equipment damage or failure from particulate and gaseous contamination:

Table 19. Particulate contamination specificationsParticulate contamination specifications.
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.

The ISO Class 8 condition applies to data center environments only. This air filtration requirement does not apply to IT equipment designed to be used outside a data center. For example, the requirement does not apply in environments such as an office or factory floor.

Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles.

This condition applies to data center and nondata center environments.
Corrosive dust Air must be free of corrosive dust.

Residual dust present in the air must have a deliquescent point less than 60% relative humidity.

This condition applies to data center and nondata center environments.

The following table provides the gaseous contamination specifications:

Table 20. Gaseous contamination specificationsGaseous contamination specifications.
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013.
Silver coupon corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013.

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