Third-Generation Intel Xeon Scalable processors with up to 40 cores
Two
PSU specifications
The XC Core XC6520 supports up to two AC power supply units (PSUs).
WARNING: Instructions for the qualified electricians only:
System using -(48-60) V DC or 240 V DC power supplies are intended for restricted access locations. See Articles 110-5, 110-6, 110-11, 110-14, and 110-17 of the National Electrical Code, American National Standards Institute (ANSI)/National Fire Protection Association (NFPA) 70.
If applicable in country or region of use, 240 V DC power supplies shall be connected to the 240 V DC outlet from certified power distribution units.
Power supply cords and jumper cords and the associated plugs, inlets, and connectors shall have appropriate electrical ratings. The ratings must reference the rating label on the system when used for connection.
Table 4. PSU specificationsPSU specifications
PSU
Class
Heat dissipation (maximum BTU/hr)
Frequency
(Hz)
Voltage
AC
Current
High line
Low line 100–120 V
2400 W
Platinum
9000
50/60
100-240 V autoranging
2400 W (200-240 V)
1400 W
16 A
2000 W
Platinum
7500
50/60
100-240 V autorangin
2000 W (200-240 V)
1000 W
11.5 A
1600 W
Platinum
6000
50/60
100-240 V autorangin
1600 W (200-240 V)
800 W
10 A
NOTE:This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 240 V.
NOTE:Heat dissipation is calculated using the PSU wattage rating.
NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Dell Dell Enterprise Infrastructure Planning Tool available at
Dell Enterprise Infrastructure Planning Tool.
Supported operating systems
The XC Core XC6520 supports the following operating systems:
Canonical Ubuntu Server LTS
Citrix Hypervisor
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware ESXi/vSAN
CentOS
Windows Preinstallation Environment (WinPE) 64-bit drivers
The XC Core XC6520 supports 24 x 2.5-inch SAS/SATA (HDD/SDD)/NVMe drives.
Table 7. DrivesDrives
Maximum number of drives in the sled
Maximum number of drives assigned per sled
24 x 2.5-inch Non-NVMe drives configuration
Six SAS or SATA drives and SATA SSDs per sled
8 x 2.5-inch NVMe drives configuration (2 NVMe drives per sled / 8 NVMe drives per chassis)
The NVMe backplane supports either of these configurations:
Two NVMe drives and four SAS or SATA drives and SATA SSDs per sled.
NOTE:NVMe drives are limited to PCIe Gen3 speed.
Six SAS or SATA drives and SATA SSDs per sled
M.2 SATA drive (optional)
The supported capacity of the M.2 SATA card is up to 960 GB.
NOTE:The M.2 SATA card can be installed on the M.2 riser or on the BOSS card.
NOTE:For more information about how to hot swap NVMe PCIe SSD U.2 device, see the
Dell Express Flash NVMe PCIe SSD User's Guide at
Dell Support (Browse all Products > Infrastructure > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Select this product > Documentation > Manuals and Documents).
Storage specifications
The XC Core XC6520 sled supports the storage controllers and drives described in the following tables:
Boot Optimized Storage Controller (BOSS-S1): HWRAID2 x M.2 SSDs
-
Table 9. Supported RAID options with M.2 SATA drivesSupported RAID options with M.2 SATA drives
Options
Dual M.2 SATA drives with hardware RAID
Hardware RAID
Yes
RAID mode
RAID 1
Number of drives supported
2
Supported CPUs
CPU 1
Ports and connectors specifications
USB ports specifications
The XC Core XC6520 sled supports USB 3.0 on the rear of the system.
Display port specifications
The XC Core XC6520 sled supports a single Mini-Display port.
The XC Core XC6520 sled supports 1 x iDRAC Direct port (Micro-AB USB) that is located on the rear of the system.
NIC port specifications
The XC Core XC6520 sled supports one 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the optional Open Compute Project (OCP) cards.
Table 10. NIC port specificationsNIC port specifications
Feature
Specifications
LOM card
1 GbE
OCP 3.0 card
10 GbE x 2, 25 GbE x 2, 25 GbE x 4, 10 GbE x 4
Video specifications
The XC Core XC6520 supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer. The following table describes the supported video resolutions:
Table 11. Video specificationsVideo specifications
Resolution
Refresh rate (Hz)
Color depth (bits)
1024 x 768
60
8, 16, 32
1280 x 800
60
8, 16, 32
1280 x 1024
60
8, 16, 32
1360 x 768
60
8, 16, 32
1440 x 900
60
8, 16, 32
1600 x 900
60
8, 16, 32
1600 x 1200
60
8, 16, 32
1680 x 1050
60
8, 16, 32
1920 x 1080
60
8, 16, 32
1920 x 1200
60
8, 16, 32
Environmental specifications
NOTE:For additional information about environmental certifications, see the product environmental datasheet that is located with the
Manuals & Documents on
Dell Support.
The following table provides information for operational climatic range, category A3:
Temperature ranges for altitudes <= 900 m (<= 2953 ft)
5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent ranges (noncondensing always)
Minimum: 8% RH with -12°C (10°F) dew point
Maximum: 85% RH with 24°C (75.2°F) dew point
Operational altitude derating
Reduce the maximum temperature by 1°C/175 m (33.8°F/574 ft) above 900 m (2953 ft)
The following table provides information for shared requirements across all categories:
Table 13. Shared requirementsShared requirements
Temperature
Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and nonoperation)
20°C (36°F) in an hour* and 5°C (9°F) in 15 minutes
For tape: 5°C (9°F) in 15 minutes
NOTE:Per ASHRAE thermal guidelines for tape hardware, these rates are not instantaneous.
Nonoperational temperature limits
-40°C to 65°C (-40°F to 149°F)
Nonoperational humidity limits
5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum nonoperational altitude
12,000 meters (39,370 ft)
Maximum operational altitude
3,048 meters (10,000 ft)
Maximum vibration specifications
The following table specifies the maximum allowed vibration:
Table 14. Maximum vibration specificationsMaximum vibration specifications
Maximum vibration
Specifications
Operating
0.26 Grms at 5 Hz to 350 Hz (all operation orientations)
Storage
1.88 Grms at 10 Hz to 500 Hz for 15 minutes
(all six sides tested)
Maximum shock pulse specifications
The following table specifies the shock pulse maxima:
Table 15. Maximum shock pulse specificationsMaximum shock pulse specifications
Maximum shock pulse
Specifications
Operating
Six consecutive shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 milliseconds
Storage
Six consecutive shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to two milliseconds.
Particulate and gaseous contamination specifications
The following table defines the limitations that help avoid any damages to the IT equipment and/or, or both failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and results in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit.
This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor.
Air entering the data center must have MERV11 or MERV13 filtration.
Air filtering can also be accomplished by filtering room air with MERV8 filter per ANSI and ASHRAE Standard 127.
Conductive dust
Air must be free of conductive dust, zinc whiskers, or other conductive particles.
This condition applies to data center and nondata center environments.
Common sources of conductive dust include manufacturing processes, and zinc whiskers from the plating on the bottom of raised floor tiles.
Corrosive dust
Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
This condition applies to data center and nondata center environments.
The following table contains gaseous contamination specifications:
<300 Å/month per Class G1 as defined by ANSI/ ISA71.04-2013
Silver Coupon Corrosion rate
<200 Å/month as defined by ANSI/ISA71.04-2013
Maximum corrosive contaminant levels measured at <=50% relative humidity.
Thermal restrictions
NOTE:
Not available: Indicates that the configuration is not offered by Dell.
Not supported: Indicates that the configuration is not thermally supported.
NOTE:All components including the DIMMs, communication cards, M.2 SATA, and PERC cards can be supported with sufficient thermal margin if the ambient temperature is equal to or below the maximum continuous operating temperature listed in these tables.
NOTE:Some of the system hardware configurations require a lowered upper temperature limit. For more information about the operating temperature requirement, contact technical support.
Some configurations require a lower ambient temperature. For more information, see the following tables.
The following tables list key restrictions on ambient temperature based on which CPU is configured in the system. All inlet temperatures that are provided below are in continuous degrees centigrade.
Table 18. Maximum continuous operating temperature for dual processor with 2.5-inch direct / 2.5-inch NVMe drive configuration - Air cooledMaximum continuous operating temperature for dual processor with 2.5-inch direct / 2.5-inch NVMe drive configuration - Air cooled
Processors
TDP (W)
Cores
6 x drives per sled
8380
270
40
Not supported
8368
270
38
Not supported
8368Q
270
38
Not supported
8362
265
32
Not supported
8360Y
250
36
Not supported
8358
250
32
Not supported
8358P
240
32
Not supported
6348
235
28
Not supported
6342
230
24
Not supported
8352Y
205
32
20
8352S
205
32
20
6338
205
32
20
6330
205
28
20
6354
205
18
Not supported
6346
205
16
Not supported
8352V
195
36
20
8352M
185
32
20*
6338N
185
32
20*
5320
185
26
20*
6336Y
185
24
20*
6326
185
16
20*
6330N
165
28
25
6338T
165
24
25
5318Y
165
24
25
5318S
165
24
25
6334
165
8
25
5318N
150
24
25*
5320T
150
20
25*
4316
150
20
25*
5317
150
12
25*
5315Y
140
8
30
4314
135
16
30*
4310
120
12
35
4310T
105
10
35
4309Y
105
8
35
NOTE:
Data with * mark means it can have a temperature offset by +5°C, if using extended processor 1 with HSK on this configuration.
Additional thermal restrictions are required for PCIE > 25 Watts, 128GB LRDIMM and GPU configuration.
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