Dell VxRail™ E665, E665F, and E665N Technical Specifications

The following table describes the thermal restriction for processor and fans for VxRail E665 Series systems:

Configuration		8 x 2.5-inch	10 x 2.5-inch drives (NVMe)
Processor TDP	Processor cTDP Max
120 W	150 W	STD fan STD heat sink	HPR fan STD heat sink
155 W	180 W	STD fan STD heat sink	HPR fan STD heat sink
180 W	200 W	STD fan HPR heat sink	HPR fan HPR heat sink
200 W	200 W	STD fan HPR heat sink	HPR fan HPR heat sink
225 W	240 W	HPR fan HPR heat sink	HPR fan HPR heat sink
240 W	240 W	HPR fan HPR heat sink	HPR fan HPR heat sink

For 10 x 2.5-inch drives (NVMe), maximum supported ambient temperature is 30°C. The following table provides the label references used in the restriction tables:

Label	Description
STD	Standard
HPR	High performance
HSK	Heat sink
LP	Low profile

Thermal restriction for ASHRAE A3/Fresh air environment

• Processor TDP equal or greater than 180 W are not supported.
• 128 GB or greater capacity LRDIMMs are not supported.
• Redundant power supply configuration is required, but PSU failure is not supported
• Non-Dell qualified peripheral cards greater than 25 W are not supported.
• GPU card is not supported.
• PCIe SSD is not supported.