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Latitude 5450 Owner's Manual

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Removing the heat sink - for computers shipped with integrated graphics card

CAUTION:The information in this removal section is intended for authorized service technicians only.

Prerequisites

  1. Follow the procedure in Before working inside your computer.
  2. Remove the nanoSIM card.
  3. Remove the base cover.
  4. Remove the WWAN card.

About this task

NOTE:The heat sink may become hot during normal operation. Allow sufficient time for the heat sink to cool before you touch it.
NOTE:For maximum cooling of the processor, do not touch the heat transfer areas on the heat sink. The oils in your skin can reduce the heat transfer capability of the thermal grease.
The following images indicate the location of the heat sink and provide a visual representation of the removal procedure.
Figure 1. Removing the heat sink - For computers shipped with 4G card
Image: Removing the heat sink
Figure 2. Removing the power shielding cover - For computers shipped with H28 UMA system board
Image: Removing the power shielding cover
Figure 3. Removing the heat sink - For computers shipped with 5G card
Image: Removing the heat sink

Steps

  1. Using a plastic scribe, pry and remove the power shielding cover.
    NOTE:Remove the power shielding cover only on computers shipped with H28 UMA system board.
  2. Peel the WWAN antenna cables and remove the cables from the routing guides on the heat sink.
  3. Loosen the four captive screws in the reverse sequential order mentioned on the heat sink [4 > 3 > 2 > 1].
    NOTE:The number of screws varies depending on the configuration ordered.
  4. Lift the heat sink from the system board.

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