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Dell XC Core Support Matrix XC450, XC650, XC750, XC750xa, XC6520, XC7525, XC4000r, XC4510c, XC4520c, and XC4000z Core

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XC7525 technical specifications

Specifications for the components of the XC7525 are provided.

The following XC7525 specifications are provided:

  • Chassis dimensions
  • Chassis weight
  • Processor specifications
  • PSU specifications
  • Supported operating systems
  • Cooling fan specifications
  • System battery specifications
  • Expansion card riser specifications
  • Memory specifications
  • Storage controller specifications
  • Drive specifications
  • Ports and connectors specifications
  • Video specifications
  • Environment specifications

Chassis dimensions

Figure 1. Chassis dimensions
Chassis dimensions

The following table provides the chassis dimensions for the XC Core XC7525:

Table 1. Chassis dimensions for the XC Core XC7525Chassis dimensions for the XC Core XC7525
Drives Xa Xb Y Za Zb Zc
12 drives 482.0 mm (18.97 inches) 434.0 mm (17.08 inches) 86.8 mm (3.41 in) 35.84 mm (1.4 in) with bezel

22 mm (0.86 in) without bezel 		837.2 mm (32.96 in)

Ear to rear wall 		872.8 mm (34.36 in)

Ear to PSU handle
24 drives 482 mm (18.97 in) 434 mm (17.08 in) 86.8 mm (3.41 in) 35.84 mm (1.4 in) with bezel

22 mm (0.86 in) without bezel 		837.2 mm (32.96 in)

Ear to rear wall 		872.8 mm (34.36 in)

Ear to PSU handle

Zb is the nominal rear wall external surface where the system board I/O connectors reside.

Chassis weight

The following table provides the XC Core XC7525 weight specifications:

Table 2. Chassis weightChassis weight
System configuration Maximum weight (with all drives/SSDs)
12 x 3.5-inch 36.3 kg (80.02 lb)
24 x 2.5-inch 28.6 kg (63.05 lb)

Processor specifications

The XC Core XC7525 supports an AMD EPY 7003 series processor.

PSU specifications

The XC Core XC7525 supports up to two AC or DC power supply units (PSUs).

WARNING:Instructions for the qualified electricians only:

Systems using -(48-60) V DC or 240 V DC power supplies are intended for restricted access locations. See Articles 110-5, 110-6, 110-11, 110-14, and 110-17 of the National Electrical Code, American National Standards Institute (ANSI)/National Fire Protection Association (NFPA) 70. If applicable in the country or region of use, 240 V DC power supplies shall be connected to the 240 V DC outlet from certified power distribution units.

Power supply cords and jumper cords and the associated plugs, inlets, and connectors shall have appropriate electrical ratings. The ratings shall reference the rating label on the system when used for connection.

The following table provides PSU specifications for the XC Core XC7525:

Table 3. PSU specifications for the XC Core XC7525PSU specifications for the XC Core XC7525
PSU Class Heat dissipation (maximum) Frequency Voltage Current
800 W Mixed Mode Platinum 3000 BTU/hr 50/60 Hz 100–240 V 9.2-4.7 A
N/A DC 240 VDC 3.8 A
1100 W Mixed Mode Titanium 4100 BTU/hr 50/60 Hz 100–240 V 12-6.3 A (X2)
N/A DC 240 VDC 5.2 ADC
1100 W (-48 VDC) N/A 4265 BTU/hr DC (-48)-(-60) VDC 27 A
1400 W Mixed Mode Platinum 5250 BTU/hr 50/60 Hz 100–240 V 12-8 A
N/A DC 240 VDC 6.6 ADC
2400 W Mixed Mode Platinum 9000 BTU/hr 50/60 Hz 100–240 V 13.5-11 A
N/A DC 240 VDC 11.2 ADC
NOTE:If a system with AC 1400 W PSU operate at low line 100-120 V AC, then the power rating per PSU is derated to 1050 W.
NOTE:If a system with AC 2400 W PSU operate at low line 100-120 V AC, then the power rating per PSU is derated to 1400 W.
NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Dell Enterprise Infrastructure Planning Tool available at Dell Enterprise Infrastructure Planning Tool.

Supported operating systems

The XC Core XC7525 supports the following operating systems:

  • VMware ESXi
  • Nutanix AHV

For more information, go to Dell | Server Operating System Support.

Cooling fan specifications

Cooling options

Maintain optimum thermal performance using cooling components that are based on the following:

  • Processor TDP
  • Storage modules
  • Graphical processing unit (GPU)
  • Persistent memory

The XC Core XC7525 uses air cooling.

Cooling fan specifications

The XC Core XC7525 supports up to six cooling fans. The following table provides details:

Table 4. Cooling fan specificationsCooling fan specifications
Fan type Abbreviation Also known as Label color Label image
Standard fan STD STD No label Standard fan
High performance fan (Silver grade) HPR Silver HPR Silver
NOTE:New cooling fans come with the High Performance Silver Grade label. Older cooling fans have the High Performance label
High Performance Silver Grade label

High Performance label
High performance GOLD fan HPR GOLD VHP - Very High Performance Gold New cooling fans come with the High-Performance Gold Grade label. The older cooling fans have the High-Performance label.

High-Performance Gold Grade label

Very high performance fan

High-Performance label
NOTE:Mixing of STD, HPR (Silver), or HPR (Gold) fan is not supported.
NOTE:The STD, HPR (Silver), or HPR (Gold) fan installation depends on the system configuration. For more information about the supported fan configuration or matrix, see Thermal restriction matrix.

System battery specifications

The XC Core XC7525 supports the CR 2032 3.0-V lithium coin cell system battery.

Expansion card riser specifications

WARNING:Consumer-Grade GPU should not be installed or used in the Enterprise Server products.

The XC Core XC7525 supports up to eight PCI express (PCIe) Gen 4 expansion cards.

The following table describes the supported expansion card slots on the XC Core XC7525 system board:

Table 5. Expansion card riser specificationsExpansion card riser specifications
PCIe slot With GPGPU shroud GPU riser module right with R1 paddle card R2a (Riser 2) GPU riser module left with R4 paddle card
Slot 3 Low profile

Half length

- x16 -
Slot 4 Full height

Half length

- - -
Slot 5 Full height

Half length

- - -
Slot 6 Low profile

Half length

- x16 -
Slot 31 Single width/ Dual width

Full height-Full length(with Dell custom bracket) 		- - x16
Slot 32 Single width/ Dual width

Full height-Full length(with Dell custom bracket) 		- - x16
Slot 33 Single width/ Dual width

Full height-Full length(with Dell custom bracket) 		x16 - -
Slot 34 Single width/ Dual width

Full height-Full length(with Dell custom bracket) 		x16 - -

Memory specifications

The XC Core XC7525 supports the following memory specifications for optimized operation.

Table 6. Memory specificationsMemory specifications
DIMM type DIMM rank DIMM capacity Single processor Dual processor
Minimum RAM Maximum RAM Minimum RAM Maximum RAM
RDIMM Dual rank 16 GB 16 GB 256 GB 32 GB 512 GB
32 GB 32 GB 512 GB 64 GB 1 TB
64 GB 64 GB 1 TB 128 GB 2 TB
LRDIMM Quad rank 128 GB 128 GB 2 TB 256 GB 4 TB
Octa rank 128 GB 128 GB 2 TB 256 GB 4 TB

The following table provides information about memory module sockets:

Table 7. Memory module socketsMemory module sockets
Memory module sockets Speed
32, 288-pin 3200 MT/s, 2933 MT/s, 2666 MT/s

Storage controller specifications

The XC Core XC7525 system supports the following internal storage controller cards:

  • HBA355I
  • Boot Optimized Storage Subsystem (BOSS-S1): HWRAID 2 x M.2 SSDs
  • Boot Optimized Storage Subsystem (BOSS-S2): HWRAID 2 x M.2 SSDs

The following table provides information on front PERC and adapter PEWRC support on backplanes:

Table 8. Front PERC and adapter PEWRC supportFront PERC and adapter PEWRC support
Front PERC Adapter PERC
24 x 2.5 inches (16 SAS/SATA X 2.5 inches + 8 X 2.5 inches NVME) 12 x 3.5 inches SAS/SATA

Disk drive specifications

The XC Core XC7525 supports the following:

  • 12 x 3.5-inch hot-swappable SAS, SATA drives.
  • 24 x 2.5-inch hot-swappable SAS, SATA , or NVMe drives. Backplane
  • Up to 8 x 2.5 inch NVMe drives.
  • Up to 12 x 3.5-inch SAS, SATA drives.
  • Up to 16 x 2.5-inch SAS, SATA drives.

For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support (Browse all Products > Infrastructure > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Select this product > Documentation > Manuals and Documents).

Ports and connectors specifications

USB ports specifications

The XC Core XC7525 system supports the USB port types that are described in the following table:

Table 9. USB ports specificationsUSB ports specifications
Front Rear Internal (Optional)
USB port type No. of ports USB port type No. of ports USB port type No. of ports
USB 2.0-compliant port One USB 2.0-compliant port One Internal USB 3.0-compliant port One
Micro-USB 2.0, iDRAC Direct One USB 3.0-compliant ports One

The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.

The USB 2.0 specifications provide a 5 V supply on a single wire to power connected USB devices. A unit load is defined as 100 mA in USB 2.0, and 150 mA in USB 3.0. A device may draw a maximum of five unit loads (500 mA) from a port in USB 2.0; 6 (900 mA) in USB 3.0.

The USB 2.0 interface can provide power to low-power peripherals but must adhere to USB specification. An external power source is required for higher-power peripherals to function, such as external CD or DVD drives.

NIC port specifications

The XC Core XC7525 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports. The ports are embedded on the LAN on the Motherboard (LOM) and integrated on the optional OCP cards. Details are provided in the following table:

Table 10. NIC port specificationsNIC port specifications
Feature Specifications
LOM card 1 GbE x 2
OCP card (OCP 3.0) 10 GbE x 2, 25 GbE x 2, 25 GbE x 4

Serial connector specifications

The XC Core XC7525 system supports one optional card type serial connector, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant .

The optional serial connector card is installed similar to an expansion card filler bracket.

VGA port specifications

The XC Core XC7525 system supports two DB-15 VGA ports, one on the front panel and one on the back panel.

IDSDM specifications

The XC Core XC7525 system supports Internal Dual SD module (IDSDM).

The IDSDM supports two SD cards and is available in the following configurations:

Video specifications

The XC Core XC7525 supports an integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

The following table describes the supported video resolutions for the front VGA port:

Table 11. Video specificationsVideo specifications
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32

The following table describes the supported resolutions for the rear VGA port:

Table 12. Supported resolutions for the rear VGA portSupported resolutions for the rear VGA port
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, see the product environmental datasheet that is located with the Manuals & Documents on Dell Support.

The following table provides specifications for operational climatic range, category A2:

Table 13. Specifications for operational climatic range, category A2Specifications for operational climatic range, category A2
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes <900 m (<2953 ft) 10–-35°C (50–-95°F) with no direct sunlight on the equipment
Humidity percent ranges (noncondensing always) Minimum: 8% RH with -12°C (53.6°F) dew point

Maximum: 80% RH with 21°C (69.8°F) dew point
Operational altitude derating Reduce the maximum temperature by 1°C/300 m (33.8°F/984 ft) above 900 m (2953 ft).

The following table provides specifications for operational climatic range, category A3:

Table 14. Specifications for operational climatic range, category A3Specifications for operational climatic range, category A3
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes <900 m (< 2953 ft) 5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent ranges (noncondensing always) Minimum: 8% RH with -12°C (10.4°F) dew point

Maximum: 85% RH with 24°C (75.2°F) dew point
Operational altitude derating Reduce the maximum temperature by 1°C/175 m (33.8°F/574 ft) above 900 m (2953 ft) .

The following table provides specifications for operational climatic range, category A4:

Table 15. Specifications for operational climatic range, category A4Specifications for operational climatic range, category A4
Temperature Specifications
Allowable continuous operations
Temperature ranges for altitudes <900 m (<2953 ft) 5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent ranges (noncondensing always) Minimum: 8% RH with -12°C (10.4°F) dew point

Maximum: 90% RH with 24°C (75.2°F) dew point
Operational altitude derating Reduce the maximum temperature by 1°C/125 m (33.8°F/410 ft) above 900 m (2953 ft).

The following table provides specifications for shared requirements across all categories:

Table 16. Shared requirementsShared requirements
Temperature Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and nonoperation) 20°C (36°F) in an hour* and 5°C (9°F) in 15 minutes

For tape: 5°C (9°F) in an hour* (9°F in an hour)
NOTE:Per ASHRAE thermal guidelines for tape hardware these rates are not instantaneous temperature changes.
Nonoperational temperature limits -40°C to 65°C (-104°F to 149°F)
Nonoperational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum nonoperational altitude 12,000 m (39,370 ft)
Maximum operational altitude 3,048 meters (10,000 ft)

The following table provides the maximum vibration specifications:

Table 17. Maximum vibration specificationsMaximum vibration specifications
Maximum vibration Specifications
Operating 0.26 Grms at 5 Hz to 500 Hz for 10 minutes (all operation orientations)
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

The following table provides the maximum shock pulse specifications:

Table 18. Maximum shock pulse specificationsMaximum shock pulse specifications
Maximum shock pulse Specifications
Operating Six consecutive shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 milliseconds.
Storage Six consecutive shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 milliseconds.

Thermal air restrictions

Fresh air environment

  • Two PSUs are required in redundant mode, however single PSU failure is not supported.
  • NVMe drive is not supported.
  • 128 GB or greater capacity DIMMs are not supported.
  • Both SW and DW GPGPU/FPGA are not supported.
  • CPU TDP equal or greater than 180 W are not supported.
  • Rear drives are not supported.
  • PCIe card TDP more than 25 W is not supported

Thermal restriction matrix

The following table provides thermal restriction matrix information:

Table 19. Thermal restriction matrixThermal restriction matrix
Configuration 8 x 2.5-inch NVMe 16 x 2.5-inch SAS 16 x 2.5-inch NVMe 16 x 2.5-inch SAS + 8 x 2.5-inch NVMe 24 x 2.5-inch NVMe 8 x 3.5-inch 12 x 3.5-inch Ambient temperature
Rear storage No rear drives No rear drives No rear drives No rear drives No rear drives No rear drives No rear drives 2 x Rear 2.5-inch No Rear Fan -
- 120 W - - - STD fan 1U STD HSK - - HPR (Silver) fan 1U STD HSK - 35°C
- 155 W - - - STD fan 1U STD HSK - - HPR (Silver) fan 1U STD HSK - 35°C
- 170 W - - - STD fan 1U STD HSK - - HPR (Silver) fan 1U STD HSK - 35°C
- 180 W - - - STD fan 2U STD Full HSK - - HPR (Silver) fan 2U Full HSK - 35°C
- 200 W - - - STD fan 2U STD Full HSK - - HPR (Silver) fan 2U Full HSK - 35°C
- 225 W STD fan 2U STD Full HSK STD fan 2U STD Full HSK STD fan 2U STD Full HSK STD fan 2U STD Full HSK HPR (Silver) fan 2U Full HSK STD fan 2U STD Full HSK HPR (Silver) fan 2U Full HSK HPR (Silver) fan 2U Full HSK 35°C
- 240 W STD fan 2U STD Full HSK STD fan 2U STD Full HSK STD fan 2U STD Full HSK STD fan 2U STD Full HSK HPR (Silver) fan 2U Full HSK STD fan 2U STD Full HSK HPR (Silver) fan 2U Full HSK HPR (Silver) fan 2U Full HSK 35°C
- 280 W STD fan 2U STD Full HSK STD fan 2U STD Full HSK STD fan 2U STD Full HSK STD fan 2U STD Full HSK HPR (Silver) fan 2U Full HSK STD fan 2U STD Full HSK HPR (Silver) fan 2U Full HSK HPR (Silver) fan 2U Full HSK 35°C
NOTE:Only 12x3.5" and 24x2.5" chassi s have 30°C limitation.
NOTE:Three fan modules are required for single processor, and six fan modules are required for dual processor system.
NOTE:If the DIMM is 128 GB and above in a12 x 3.5-inch chassis with CPU TDP/cTDP is greater than 200 W or 12 x 3.5" + x2 rear-drive chassis with CPU TDP/cTDP greater than 170 W.

The following table provides air cooling and GPU/FPGA thermal restriction matrix information.

Table 20. Air cooling and GPU/FPGA thermal restriction matrixAir cooling and GPU/FPGA thermal restriction matrix
Configuration (front storage) Fan type Max CPU TDP/cTDP GPU/FPGA (ambient temperature)
T4 V100 (16 GB) V100 S M10 Snow white RTX 6000 RTX 8000 A100 M100 A40 A10 A30
No backplane HPR (Silver) 280 W - - - 35°C - - - 35°C - 30°C 30°C 35°C
8 x 2.5-inch NVMe HPR (Silver) 280 W - - - 35°C - - - 35°C - 30°C 30°C 35°C
16 x 2.5-inch SAS HPR (Silver) 280 W 30°C 35°C 30°C 35°C 35°C 35°C 35°C 35°C 30°C 30°C 30°C 35°C
16 x 2.5-inch NVMe HPR (Gold) 280 W 30°C 35°C 30°C 35°C 35°C 35°C 35°C 35°C 30°C 30°C 30°C 35°C
16 x 2.5-inch SAS + 8 x 2.5-inch NVMe HPR (Gold) 280 W 30°C 35°C 30°C 35°C 35°C 35°C 35°C 35°C 30°C 30°C 30°C 35°C
8 x 3.5-inch SAS HPR (Silver) 280 W 30°C 35°C 30°C 35°C 35°C 35°C 35°C 35°C 30°C 30°C 30°C 35°C
NOTE:GPU is not supported in 12 x 3.5-inch hard drive and 24 x 2.5-inch NVMe configuration systems.
NOTE:Low Profile and Full Height T4 cards are installed in order to support maximun 6 pcs T4 in x 16 slots.

Processor and heat sink matrix

The following table provides the processor and heat sink matrix:

Table 21. Processor and heat sink matrixProcessor and heat sink matrix
Heat sink Processor TDP
STD HSK < 180 W
2U HPR HSK >= 180 W
L-type HSK Supports all TDP (system should be installed with GPU/FPGA/long PCIe cards)
NOTE:All GPU/FGPA cards require 1U L-type HSK and GPU shroud.

Label reference

The following table describes label references:

Table 22. Label referenceLabel reference
Label Explanation
STD Standard
HPR (Silver) High performance (silver grade)
HPR (Gold) High performance (gold grade)
HSK Heat sink
LP Low profile
FH Full height

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