Specifications for the components of the XC7525 are provided.
The following XC7525 specifications are provided:
Chassis dimensions
Chassis weight
Processor specifications
PSU specifications
Supported operating systems
Cooling fan specifications
System battery specifications
Expansion card riser specifications
Memory specifications
Storage controller specifications
Drive specifications
Ports and connectors specifications
Video specifications
Environment specifications
Chassis dimensions
Figure 1. Chassis dimensions
The following table provides the chassis dimensions for the XC Core XC7525:
Table 1. Chassis dimensions for the XC Core XC7525Chassis dimensions for the XC Core XC7525
Drives
Xa
Xb
Y
Za
Zb
Zc
12 drives
482.0 mm (18.97 inches)
434.0 mm (17.08 inches)
86.8 mm (3.41 in)
35.84 mm (1.4 in) with bezel
22 mm (0.86 in) without bezel
837.2 mm (32.96 in)
Ear to rear wall
872.8 mm (34.36 in)
Ear to PSU handle
24 drives
482 mm (18.97 in)
434 mm (17.08 in)
86.8 mm (3.41 in)
35.84 mm (1.4 in) with bezel
22 mm (0.86 in) without bezel
837.2 mm (32.96 in)
Ear to rear wall
872.8 mm (34.36 in)
Ear to PSU handle
Zb is the nominal rear wall external surface where the system board I/O connectors reside.
Chassis weight
The following table provides the XC Core XC7525 weight specifications:
Table 2. Chassis weightChassis weight
System configuration
Maximum weight (with all drives/SSDs)
12 x 3.5-inch
36.3 kg (80.02 lb)
24 x 2.5-inch
28.6 kg (63.05 lb)
Processor specifications
The XC Core XC7525 supports an AMD EPY 7003 series processor.
PSU specifications
The XC Core XC7525 supports up to two AC or DC power supply units (PSUs).
WARNING:Instructions for the qualified electricians only:
Systems using -(48-60) V DC or 240 V DC power supplies are intended for restricted access locations. See Articles 110-5, 110-6, 110-11, 110-14, and 110-17 of the National Electrical Code, American National Standards Institute (ANSI)/National Fire Protection Association (NFPA) 70. If applicable in the country or region of use, 240 V DC power supplies shall be connected to the 240 V DC outlet from certified power distribution units.
Power supply cords and jumper cords and the associated plugs, inlets, and connectors shall have appropriate electrical ratings. The ratings shall reference the rating label on the system when used for connection.
The following table provides PSU specifications for the XC Core XC7525:
Table 3. PSU specifications for the XC Core XC7525PSU specifications for the XC Core XC7525
PSU
Class
Heat dissipation (maximum)
Frequency
Voltage
Current
800 W Mixed Mode
Platinum
3000 BTU/hr
50/60 Hz
100–240 V
9.2-4.7 A
N/A
DC
240 VDC
3.8 A
1100 W Mixed Mode
Titanium
4100 BTU/hr
50/60 Hz
100–240 V
12-6.3 A (X2)
N/A
DC
240 VDC
5.2 ADC
1100 W (-48 VDC)
N/A
4265 BTU/hr
DC
(-48)-(-60) VDC
27 A
1400 W Mixed Mode
Platinum
5250 BTU/hr
50/60 Hz
100–240 V
12-8 A
N/A
DC
240 VDC
6.6 ADC
2400 W Mixed Mode
Platinum
9000 BTU/hr
50/60 Hz
100–240 V
13.5-11 A
N/A
DC
240 VDC
11.2 ADC
NOTE:If a system with AC 1400 W PSU operate at low line 100-120 V AC, then the power rating per PSU is derated to 1050 W.
NOTE:If a system with AC 2400 W PSU operate at low line 100-120 V AC, then the power rating per PSU is derated to 1400 W.
NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Dell Enterprise Infrastructure Planning Tool available at
Dell Enterprise Infrastructure Planning Tool.
Supported operating systems
The XC Core XC7525 supports the following operating systems:
Maintain optimum thermal performance using cooling components that are based on the following:
Processor TDP
Storage modules
Graphical processing unit (GPU)
Persistent memory
The XC Core XC7525 uses air cooling.
Cooling fan specifications
The XC Core XC7525 supports up to six cooling fans. The following table provides details:
Table 4. Cooling fan specificationsCooling fan specifications
Fan type
Abbreviation
Also known as
Label color
Label image
Standard fan
STD
STD
No label
High performance fan (Silver grade)
HPR Silver
HPR
Silver
NOTE:New cooling fans come with the High Performance Silver Grade label. Older cooling fans have the High Performance label
High performance GOLD fan
HPR GOLD
VHP - Very High Performance
Gold
New cooling fans come with the High-Performance Gold Grade label. The older cooling fans have the High-Performance label.
Very high performance fan
NOTE:Mixing of STD, HPR (Silver), or HPR (Gold) fan is not supported.
NOTE:The STD, HPR (Silver), or HPR (Gold) fan installation depends on the system configuration. For more information about the supported fan configuration or matrix, see Thermal restriction matrix.
System battery specifications
The XC Core XC7525 supports the CR 2032 3.0-V lithium coin cell system battery.
Expansion card riser specifications
WARNING:Consumer-Grade GPU should not be installed or used in the Enterprise Server products.
The XC Core XC7525 supports up to eight PCI express (PCIe) Gen 4 expansion cards.
The following table describes the supported expansion card slots on the XC Core XC7525 system board:
The XC Core XC7525 system supports the following internal storage controller cards:
HBA355I
Boot Optimized Storage Subsystem (BOSS-S1): HWRAID 2 x M.2 SSDs
Boot Optimized Storage Subsystem (BOSS-S2): HWRAID 2 x M.2 SSDs
The following table provides information on front PERC and adapter PEWRC support on backplanes:
Table 8. Front PERC and adapter PEWRC supportFront PERC and adapter PEWRC support
Front PERC
Adapter PERC
24 x 2.5 inches (16 SAS/SATA X 2.5 inches + 8 X 2.5 inches NVME)
12 x 3.5 inches SAS/SATA
Disk drive specifications
The XC Core XC7525 supports the following:
12 x 3.5-inch hot-swappable SAS, SATA drives.
24 x 2.5-inch hot-swappable SAS, SATA , or NVMe drives. Backplane
Up to 8 x 2.5 inch NVMe drives.
Up to 12 x 3.5-inch SAS, SATA drives.
Up to 16 x 2.5-inch SAS, SATA drives.
For more information about how to hot swap NVMe PCIe SSD U.2 device, see the
Dell Express Flash NVMe PCIe SSD User's Guide at
Dell Support (Browse all Products > Infrastructure > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Select this product > Documentation > Manuals and Documents).
Ports and connectors specifications
USB ports specifications
The XC Core XC7525 system supports the USB port types that are described in the following table:
Table 9. USB ports specificationsUSB ports specifications
Front
Rear
Internal (Optional)
USB port type
No. of ports
USB port type
No. of ports
USB port type
No. of ports
USB 2.0-compliant port
One
USB 2.0-compliant port
One
Internal USB 3.0-compliant port
One
Micro-USB 2.0, iDRAC Direct
One
USB 3.0-compliant ports
One
The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.
The USB 2.0 specifications provide a 5 V supply on a single wire to power connected USB devices. A unit load is defined as 100 mA in USB 2.0, and 150 mA in USB 3.0. A device may draw a maximum of five unit loads (500 mA) from a port in USB 2.0; 6 (900 mA) in USB 3.0.
The USB 2.0 interface can provide power to low-power peripherals but must adhere to USB specification. An external power source is required for higher-power peripherals to function, such as external CD or DVD drives.
NIC port specifications
The XC Core XC7525 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports. The ports are embedded on the LAN on the Motherboard (LOM) and integrated on the optional OCP cards. Details are provided in the following table:
Table 10. NIC port specificationsNIC port specifications
Feature
Specifications
LOM card
1 GbE x 2
OCP card (OCP 3.0)
10 GbE x 2, 25 GbE x 2, 25 GbE x 4
Serial connector specifications
The XC Core XC7525 system supports one optional card type serial connector, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant .
The optional serial connector card is installed similar to an expansion card filler bracket.
VGA port specifications
The XC Core XC7525 system supports two DB-15 VGA ports, one on the front panel and one on the back panel.
IDSDM specifications
The XC Core XC7525 system supports Internal Dual SD module (IDSDM).
The IDSDM supports two SD cards and is available in the following configurations:
Video specifications
The XC Core XC7525 supports an integrated Matrox G200 graphics controller with 16 MB of video frame buffer.
The following table describes the supported video resolutions for the front VGA port:
Table 11. Video specificationsVideo specifications
Resolution
Refresh rate (Hz)
Color depth (bits)
1024 x 768
60
8, 16, 32
1280 x 800
60
8, 16, 32
1280 x 1024
60
8, 16, 32
1360 x 768
60
8, 16, 32
1440 x 900
60
8, 16, 32
The following table describes the supported resolutions for the rear VGA port:
Table 12. Supported resolutions for the rear VGA portSupported resolutions for the rear VGA port
Resolution
Refresh rate (Hz)
Color depth (bits)
1024 x 768
60
8, 16, 32
1280 x 800
60
8, 16, 32
1280 x 1024
60
8, 16, 32
1360 x 768
60
8, 16, 32
1440 x 900
60
8, 16, 32
1600 x 900
60
8, 16, 32
1600 x 1200
60
8, 16, 32
1680 x 1050
60
8, 16, 32
1920 x 1080
60
8, 16, 32
1920 x 1200
60
8, 16, 32
Environmental specifications
NOTE:For additional information about environmental certifications, see the product environmental datasheet that is located with the
Manuals & Documents on
Dell Support.
The following table provides specifications for operational climatic range, category A2:
Table 13. Specifications for operational climatic range, category A2Specifications for operational climatic range, category A2
Temperature
Specifications
Allowable continuous operations
Temperature ranges for altitudes <900 m (<2953 ft)
10–-35°C (50–-95°F) with no direct sunlight on the equipment
Humidity percent ranges (noncondensing always)
Minimum: 8% RH with -12°C (53.6°F) dew point
Maximum: 80% RH with 21°C (69.8°F) dew point
Operational altitude derating
Reduce the maximum temperature by 1°C/300 m (33.8°F/984 ft) above 900 m (2953 ft).
The following table provides specifications for operational climatic range, category A3:
Table 14. Specifications for operational climatic range, category A3Specifications for operational climatic range, category A3
Temperature
Specifications
Allowable continuous operations
Temperature ranges for altitudes <900 m (< 2953 ft)
5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent ranges (noncondensing always)
Minimum: 8% RH with -12°C (10.4°F) dew point
Maximum: 85% RH with 24°C (75.2°F) dew point
Operational altitude derating
Reduce the maximum temperature by 1°C/175 m (33.8°F/574 ft) above 900 m (2953 ft) .
The following table provides specifications for operational climatic range, category A4:
Table 15. Specifications for operational climatic range, category A4Specifications for operational climatic range, category A4
Temperature
Specifications
Allowable continuous operations
Temperature ranges for altitudes <900 m (<2953 ft)
5–45°C (41–113°F) with no direct sunlight on the equipment
Humidity percent ranges (noncondensing always)
Minimum: 8% RH with -12°C (10.4°F) dew point
Maximum: 90% RH with 24°C (75.2°F) dew point
Operational altitude derating
Reduce the maximum temperature by 1°C/125 m (33.8°F/410 ft) above 900 m (2953 ft).
The following table provides specifications for shared requirements across all categories:
Table 16. Shared requirementsShared requirements
Temperature
Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and nonoperation)
20°C (36°F) in an hour* and 5°C (9°F) in 15 minutes
For tape: 5°C (9°F) in an hour* (9°F in an hour)
NOTE:Per ASHRAE thermal guidelines for tape hardware these rates are not instantaneous temperature changes.
Nonoperational temperature limits
-40°C to 65°C (-104°F to 149°F)
Nonoperational humidity limits
5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum nonoperational altitude
12,000 m (39,370 ft)
Maximum operational altitude
3,048 meters (10,000 ft)
The following table provides the maximum vibration specifications:
Table 17. Maximum vibration specificationsMaximum vibration specifications
Maximum vibration
Specifications
Operating
0.26 Grms at 5 Hz to 500 Hz for 10 minutes (all operation orientations)
Storage
1.88 Grms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)
The following table provides the maximum shock pulse specifications:
Table 18. Maximum shock pulse specificationsMaximum shock pulse specifications
Maximum shock pulse
Specifications
Operating
Six consecutive shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 milliseconds.
Storage
Six consecutive shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 milliseconds.
Thermal air restrictions
Fresh air environment
Two PSUs are required in redundant mode, however single PSU failure is not supported.
NVMe drive is not supported.
128 GB or greater capacity DIMMs are not supported.
Both SW and DW GPGPU/FPGA are not supported.
CPU TDP equal or greater than 180 W are not supported.
Rear drives are not supported.
PCIe card TDP more than 25 W is not supported
Thermal restriction matrix
The following table provides thermal restriction matrix information:
NOTE:Only 12x3.5" and 24x2.5" chassi s have 30°C limitation.
NOTE:Three fan modules are required for single processor, and six fan modules are required for dual processor system.
NOTE:If the DIMM is 128 GB and above in a12 x 3.5-inch chassis with CPU TDP/cTDP is greater than 200 W or 12 x 3.5" + x2 rear-drive chassis with CPU TDP/cTDP greater than 170 W.
The following table provides air cooling and GPU/FPGA thermal restriction matrix information.
Table 20. Air cooling and GPU/FPGA thermal restriction matrixAir cooling and GPU/FPGA thermal restriction matrix
Configuration (front storage)
Fan type
Max CPU TDP/cTDP
GPU/FPGA (ambient temperature)
T4
V100 (16 GB)
V100 S
M10
Snow white
RTX 6000
RTX 8000
A100
M100
A40
A10
A30
No backplane
HPR (Silver)
280 W
-
-
-
35°C
-
-
-
35°C
-
30°C
30°C
35°C
8 x 2.5-inch NVMe
HPR (Silver)
280 W
-
-
-
35°C
-
-
-
35°C
-
30°C
30°C
35°C
16 x 2.5-inch SAS
HPR (Silver)
280 W
30°C
35°C
30°C
35°C
35°C
35°C
35°C
35°C
30°C
30°C
30°C
35°C
16 x 2.5-inch NVMe
HPR (Gold)
280 W
30°C
35°C
30°C
35°C
35°C
35°C
35°C
35°C
30°C
30°C
30°C
35°C
16 x 2.5-inch SAS + 8 x 2.5-inch NVMe
HPR (Gold)
280 W
30°C
35°C
30°C
35°C
35°C
35°C
35°C
35°C
30°C
30°C
30°C
35°C
8 x 3.5-inch SAS
HPR (Silver)
280 W
30°C
35°C
30°C
35°C
35°C
35°C
35°C
35°C
30°C
30°C
30°C
35°C
NOTE:GPU is not supported in 12 x 3.5-inch hard drive and 24 x 2.5-inch NVMe configuration systems.
NOTE:Low Profile and Full Height T4 cards are installed in order to support maximun 6 pcs T4 in x 16 slots.
Processor and heat sink matrix
The following table provides the processor and heat sink matrix:
Table 21. Processor and heat sink matrixProcessor and heat sink matrix
Heat sink
Processor TDP
STD HSK
< 180 W
2U HPR HSK
>= 180 W
L-type HSK
Supports all TDP (system should be installed with GPU/FPGA/long PCIe cards)
NOTE:All GPU/FGPA cards require 1U L-type HSK and GPU shroud.
Label reference
The following table describes label references:
Table 22. Label referenceLabel reference
Label
Explanation
STD
Standard
HPR (Silver)
High performance (silver grade)
HPR (Gold)
High performance (gold grade)
HSK
Heat sink
LP
Low profile
FH
Full height
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