Dell XC Core Support Matrix XC450, XC650, XC750, XC750xa, XC6520, XC7525, XC4000r, XC4510c, XC4520c, and XC4000z Core

XC6520 technical specifications

Specifications for the components of the XC6520 are provided.

The following XC6520 specifications are provided:

Sled dimensions
Sled weight
Processor specifications
PSU specifications
Supported operating systems
System battery specifications
Expansion card riser specifications
Memory specifications
Drives
Storage specifications
Ports and connectors specifications
Video specifications
Environmental specifications

Sled dimensions

The following table provides the sled dimensions for the XC Core XC6520:

Table 1. Sled dimensions for the XC Core XC6520Sled dimensions for the XC Core XC6520
X	Y	Z
174.4 mm (6.86 in)	40.1 mm (1.58 in)	570.34 mm (22.45 in)

Sled weight

The following table provides the XC Core XC6520 sled weight specifications:

Table 2. Sled weight specificationsSled weight specifications
System configuration	Maximum weight (with all sleds and drives)
12 x 3.5-inch	45.6 kg (100.53 lb)
24 x 2.5-inch	41.4 kg (91.27 lb)
System with no backplane	35 kg (77.16 lb)

Processor specifications

The following table provides processor specifications for the XC Core XC6520.

Table 3. Processor specificationsProcessor specifications
Supported processor	Number of processors supported
Third-Generation Intel Xeon Scalable processors with up to 40 cores	Two

PSU specifications

The XC Core XC6520 supports up to two AC power supply units (PSUs).

WARNING: Instructions for the qualified electricians only:

System using -(48-60) V DC or 240 V DC power supplies are intended for restricted access locations. See Articles 110-5, 110-6, 110-11, 110-14, and 110-17 of the National Electrical Code, American National Standards Institute (ANSI)/National Fire Protection Association (NFPA) 70.

If applicable in country or region of use, 240 V DC power supplies shall be connected to the 240 V DC outlet from certified power distribution units.

Power supply cords and jumper cords and the associated plugs, inlets, and connectors shall have appropriate electrical ratings. The ratings must reference the rating label on the system when used for connection.

Table 4. PSU specificationsPSU specifications
PSU	Class	Heat dissipation (maximum BTU/hr)	Frequency (Hz)	Voltage	AC		Current
PSU	Class	Heat dissipation (maximum BTU/hr)	Frequency (Hz)	Voltage	High line	Low line 100–120 V	Current
2400 W	Platinum	9000	50/60	100-240 V autoranging	2400 W (200-240 V)	1400 W	16 A
2000 W	Platinum	7500	50/60	100-240 V autorangin	2000 W (200-240 V)	1000 W	11.5 A
1600 W	Platinum	6000	50/60	100-240 V autorangin	1600 W (200-240 V)	800 W	10 A

NOTE:This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 240 V.

NOTE:Heat dissipation is calculated using the PSU wattage rating.

NOTE:When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Dell Dell Enterprise Infrastructure Planning Tool available at Dell Enterprise Infrastructure Planning Tool.

Supported operating systems

The XC Core XC6520 supports the following operating systems:

Canonical Ubuntu Server LTS
Citrix Hypervisor
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware ESXi/vSAN
CentOS
Windows Preinstallation Environment (WinPE) 64-bit drivers

For more information, go to Dell | Server Operating System Support.

System battery specifications

The XC Core XC6520 supports CR 2032 3.0-V lithium coin cell system battery.

Expansion card riser specifications

The XC Core XC6520 supports up to four PCI express (PCIe) Gen 4 expansion cards.

Memory specifications

The XC Core XC6520 supports the following memory specifications for optimized operation:

Table 5. Memory specificationsMemory specifications
DIMM type	DIMM rank	DIMM capacity	Single processor		Dual processor
DIMM type	DIMM rank	DIMM capacity	Minimum system capacity	Maximum system capacity	Minimum system capacity	Maximum system capacity
RDIMM	Dual rank	16 GB	16 GB	128 GB	32 GB	256 GB
		32 GB	32 GB	256 GB	64 GB	512 GB
		64 GB	64 GB	512 GB	128 GB	1 TB
LRDIMM	Quad rank	64 GB	64 GB	512 GB	128 GB	1 TB
LRDIMM	Octa rank	128 GB	128 GB	1 TB	256 GB	2 TB

The following table describes the memory module socket specifications:

Table 6. Memory module socket specificationsMemory module socket specifications
Memory module sockets	Speed
16, 288-pin	3200 MT/s, 2933 MT/s, 2666 MT/s

Drives

The XC Core XC6520 supports 24 x 2.5-inch SAS/SATA (HDD/SDD)/NVMe drives.

Table 7. DrivesDrives
Maximum number of drives in the sled	Maximum number of drives assigned per sled
24 x 2.5-inch Non-NVMe drives configuration	Six SAS or SATA drives and SATA SSDs per sled
8 x 2.5-inch NVMe drives configuration (2 NVMe drives per sled / 8 NVMe drives per chassis)	The NVMe backplane supports either of these configurations: Two NVMe drives and four SAS or SATA drives and SATA SSDs per sled. NOTE:NVMe drives are limited to PCIe Gen3 speed. Six SAS or SATA drives and SATA SSDs per sled
M.2 SATA drive (optional)	The supported capacity of the M.2 SATA card is up to 960 GB. NOTE:The M.2 SATA card can be installed on the M.2 riser or on the BOSS card.

NOTE:For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at Dell Support (Browse all Products > Infrastructure > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Select this product > Documentation > Manuals and Documents).

Storage specifications

The XC Core XC6520 sled supports the storage controllers and drives described in the following tables:

Table 8. Supported controller cardsSupported controller cards
Internal controllers	External controllers
HBA355	12 Gbps SAS external HBA
Boot Optimized Storage Controller (BOSS-S1): HWRAID2 x M.2 SSDs	-

Table 9. Supported RAID options with M.2 SATA drivesSupported RAID options with M.2 SATA drives
Options	Dual M.2 SATA drives with hardware RAID
Hardware RAID	Yes
RAID mode	RAID 1
Number of drives supported	2
Supported CPUs	CPU 1

Ports and connectors specifications

USB ports specifications

The XC Core XC6520 sled supports USB 3.0 on the rear of the system.

Display port specifications

The XC Core XC6520 sled supports a single Mini-Display port.

The XC Core XC6520 sled supports 1 x iDRAC Direct port (Micro-AB USB) that is located on the rear of the system.

NIC port specifications

The XC Core XC6520 sled supports one 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the optional Open Compute Project (OCP) cards.

Table 10. NIC port specificationsNIC port specifications
Feature	Specifications
LOM card	1 GbE
OCP 3.0 card	10 GbE x 2, 25 GbE x 2, 25 GbE x 4, 10 GbE x 4

Video specifications

The XC Core XC6520 supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer. The following table describes the supported video resolutions:

Table 11. Video specificationsVideo specifications
Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, see the product environmental datasheet that is located with the Manuals & Documents on Dell Support.

The following table provides information for operational climatic range, category A3:

Table 12. Operational climatic range, category A3Operational climatic range, category A3
Temperature	Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2953 ft)	5–40°C (41–104°F) with no direct sunlight on the equipment
Humidity percent ranges (noncondensing always)	Minimum: 8% RH with -12°C (10°F) dew point Maximum: 85% RH with 24°C (75.2°F) dew point
Operational altitude derating	Reduce the maximum temperature by 1°C/175 m (33.8°F/574 ft) above 900 m (2953 ft)

The following table provides information for shared requirements across all categories:

Table 13. Shared requirementsShared requirements
Temperature	Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and nonoperation)	20°C (36°F) in an hour* and 5°C (9°F) in 15 minutes For tape: 5°C (9°F) in 15 minutes NOTE:Per ASHRAE thermal guidelines for tape hardware, these rates are not instantaneous.
Nonoperational temperature limits	-40°C to 65°C (-40°F to 149°F)
Nonoperational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum nonoperational altitude	12,000 meters (39,370 ft)
Maximum operational altitude	3,048 meters (10,000 ft)

Maximum vibration specifications

The following table specifies the maximum allowed vibration:

Table 14. Maximum vibration specificationsMaximum vibration specifications
Maximum vibration	Specifications
Operating	0.26 G_rms at 5 Hz to 350 Hz (all operation orientations)
Storage	1.88 G_rms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

Maximum shock pulse specifications

The following table specifies the shock pulse maxima:

Table 15. Maximum shock pulse specificationsMaximum shock pulse specifications
Maximum shock pulse	Specifications
Operating	Six consecutive shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 milliseconds
Storage	Six consecutive shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to two milliseconds.

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any damages to the IT equipment and/or, or both failure from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and results in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

Table 16. Particulate contamination specificationsParticulate contamination specifications
Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Air entering the data center must have MERV11 or MERV13 filtration. Air filtering can also be accomplished by filtering room air with MERV8 filter per ANSI and ASHRAE Standard 127.
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles. This condition applies to data center and nondata center environments. Common sources of conductive dust include manufacturing processes, and zinc whiskers from the plating on the bottom of raised floor tiles.
Corrosive dust	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. This condition applies to data center and nondata center environments.

The following table contains gaseous contamination specifications:

Table 17. Gaseous contamination specificationsGaseous contamination specifications
Gaseous contamination	Specifications
Copper Coupon Corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ ISA71.04-2013
Silver Coupon Corrosion rate	<200 Å/month as defined by ANSI/ISA71.04-2013

Maximum corrosive contaminant levels measured at <=50% relative humidity.

Thermal restrictions

NOTE:

Not available: Indicates that the configuration is not offered by Dell.
Not supported: Indicates that the configuration is not thermally supported.

NOTE:All components including the DIMMs, communication cards, M.2 SATA, and PERC cards can be supported with sufficient thermal margin if the ambient temperature is equal to or below the maximum continuous operating temperature listed in these tables.

NOTE:Some of the system hardware configurations require a lowered upper temperature limit. For more information about the operating temperature requirement, contact technical support.

Some configurations require a lower ambient temperature. For more information, see the following tables.

The following tables list key restrictions on ambient temperature based on which CPU is configured in the system. All inlet temperatures that are provided below are in continuous degrees centigrade.

Table 18. Maximum continuous operating temperature for dual processor with 2.5-inch direct / 2.5-inch NVMe drive configuration - Air cooledMaximum continuous operating temperature for dual processor with 2.5-inch direct / 2.5-inch NVMe drive configuration - Air cooled
Processors	TDP (W)	Cores	6 x drives per sled
8380	270	40	Not supported
8368	270	38	Not supported
8368Q	270	38	Not supported
8362	265	32	Not supported
8360Y	250	36	Not supported
8358	250	32	Not supported
8358P	240	32	Not supported
6348	235	28	Not supported
6342	230	24	Not supported
8352Y	205	32	20
8352S	205	32	20
6338	205	32	20
6330	205	28	20
6354	205	18	Not supported
6346	205	16	Not supported
8352V	195	36	20
8352M	185	32	20*
6338N	185	32	20*
5320	185	26	20*
6336Y	185	24	20*
6326	185	16	20*
6330N	165	28	25
6338T	165	24	25
5318Y	165	24	25
5318S	165	24	25
6334	165	8	25
5318N	150	24	25*
5320T	150	20	25*
4316	150	20	25*
5317	150	12	25*
5315Y	140	8	30
4314	135	16	30*
4310	120	12	35
4310T	105	10	35
4309Y	105	8	35