Dell XC Core Support Matrix XC450, XC650, XC750, XC750xa, XC6520, XC7525, XC4000r, XC4510c, XC4520c, and XC4000z Core

XC450 technical specifications

Specifications for the components of the XC450 are provided.

The following XC450 specifications are provided:

Chassis dimensions
System weight
Processor specifications
PSU specifications
Supported operating systems
Cooling fan specifications
System battery specifications
Expansion card riser specifications
Memory specifications
Storage controller specifications
Disk drives
USB port specifications
NIC port specifications
Serial connector specifications
VGA port specifications
Video specifications
Environment specifications
Particulate and gaseous contamination specifications
Thermal restrictions

Chassis dimensions

The following table provides the chassis dimensions for the XC Core XC450:

Table 1. Chassis dimensions for the XC Core XC450Chassis dimensions for the XC Core XC450.
Drives	Xa	Xb	Y	Za	Zb	Zc
4 x 3.5 in	482 mm (18.976 in)	434 mm (17.08 in)	42.8 mm (1.685 in)	22 mm (0.866 in) without bezel 35.84 mm (1.41 in) with bezel	677.8 mm (26.685 in) (Ear to PSU surface) 691.07mm (27.207 in) (Ear to butterfly L bracket housing)	712.95 mm (28.069 in) (Ear to PSU handle without velcro strap)

System weight

The following table provides the XC Core XC450 weight:

Table 2. XC Core XC450 weightXC Core XC450 weight
System configuration	Maximum weight (with all drives/SSDs/bezel)
4 x 3.5-inch system	18.62 kg (41.05 pound)

Processor specifications

The following table provides the processor specifications for the XC Core XC450:

Table 3. Processor specifications for the XC Core XC450Processor specifications for the XC Core XC450
Supported processor	Number of processors supported
3rd Generation Intel Xeon Scalable processors with up to 24 cores	Up to two

Table 4. PSU specificationsPSU specifications
PSU	Class	Heat dissipation (maximum)	Frequency	Voltage	AC		DC	Current
PSU	Class	Heat dissipation (maximum)	Frequency	Voltage	High line 200–240 V	Low line 100–120 V	DC	Current
1100 W DC	NA	4265 BTU/hr	NA	-48–(-60) V	NA	NA	1100 W	27 A
800 W Mixed Mode	Platinum	3000 BTU/hr	50/60 Hz	100–240 V AC, autoranging	800 W	800 W	NA	9.2 A-4.7 A
800 W Mixed Mode	NA	3000 BTU/hr	NA	240 V DC, autoranging	NA	NA	800 W	3.8 A
600 W Mixed Mode	Platinum	2250 BTU/hr	50/60 Hz	100–240 V AC, autoranging	600 W	600 W	NA	7.1 A-3.6 A
600 W Mixed Mode	NA	2250 BTU/hr	NA	240 V DC, autoranging	NA	NA	600 W	2.9 A

This XC Core XC450 is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 240 V.

Heat dissipation is calculated using the PSU wattage rating.

When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system power consumption with the Dell Enterprise Infrastructure Planning Tool available at Dell Enterprise Infrastructure Planning Tool.

Supported operating systems

The XC Core XC450 supports the following operating systems:

VMware ESXi
AHV

For more information, go to Dell | Server Operating System Support.

Table 5. Cooling fans specificationsCooling fans specifications
Fan type	Abbreviation	Also known as	Label color	Label image
Standard fan	STD	STD	No label	Standard fan
High performance (Silver grade) fan	HPR (SLVR)	HPR	Silver	New cooling fans comes with the High Performance Silver Grade label. The older cooling fans have the High Performance label. High performance (Silver grade) fan

System battery specifications

The XC Core XC450 supports CR 2032 3.0-V lithium coin cell system battery.

Expansion card riser specifications

The XC Core XC450 supports up to two PCI express (PCIe) Gen 4 expansion cards.

The following table provides details on the supported expansion card risers:

Table 6. Supported expansion card risersSupported expansion card risers
PCIe slot	Riser	PCIe slot height	PCIe slot length	PCIe slot width
Slot 1	Riser 1 (4 and 4S)	Low Profile	Half length	x16
Slot 3	Riser 2c (4 only)	Low Profile	Half length	x16

For information on the expansion card installation guidelines, see the system-specific installation and service manual available at Dell Support (Browse all Products > Infrastructure, then go to the system.)

The XC Core XC450 supports the following memory specifications for optimized operation:

Table 7. Memory specificationsMemory specifications.
DIMM type	DIMM rank	DIMM capacity	Single processor		Dual processors
DIMM type	DIMM rank	DIMM capacity	Minimum DIMM capacity	Maximum DIMM capacity	Dual processors
RDIMM	Dual rank	16 GB	16 GB	128 GB	32 GB	256 GB
RDIMM	Dual rank	32 GB	32 GB	256 GB	64 GB	512 GB
RDIMM	Dual rank	64 GB	64 GB	512 GB	128 GB	1 TB

The following table memory module specifications:

Table 8. Memory module specificationsMemory module specifications.
Memory module sockets	Speed
16, 288-pin	2933 MT/s, 2666 MT/s

Storage controller specifications

The XC Core XC450 supports the following controller cards:

HBA355i
Boot Optimized Storage Subsystem (BOSS-S1): HWRAID 2 x M.2 SSDs

Disk drives

The XC Core XC450 supports 4 x 3.5-in hot-swappable SAS, SATA (HDD/SSD) drives.

USB ports specifications

The XC Core XC450 supports the USB ports listed in the following table:

Table 9. Supported USB portsSupported USB ports
Front	Front	Rear	Rear	Internal (Optional)	Internal (Optional)
USB port type	No. of ports	USB port type	No. of ports	USB port type	No. of ports
USB 3.0-compliant port	One	USB 2.0-compliant port	One	Internal USB 3.0-compliant port	One
Micro-USB 2.0-compliant port for iDRAC Direct	One	USB 3.0-compliant port	One	Internal USB 3.0-compliant port	One

The micro USB 2.0-compliant port can only be used as an iDRAC Direct or a management port.

NIC port specifications

The XC Core XC450 supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded on the LAN on Motherboard (LOM) and integrated on the optional Open Compute Project (OCP) cards. The following table provides details:

Table 10. NIC port specificationsNIC port specifications
Feature	Specifications
LOM card	1 GbE x 2
OCP card (OCP 3.0)	1 GbE x 4, 10 GbE x 2, 25 GbE x 2, 25 GbE x 4

Serial connector specifications

The XC Core XC450 supports one optional card type serial connector on rear of the system. The connector is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant .

The process to install the optional serial connector card is similar to an expansion card filler bracket.

VGA ports specifications

The XC Core XC450 supports two DB-15 VGA ports, one each on the front and rear panels of the system.

Video specifications

The XC Core XC450 supports an integrated Matrox G200 graphics controller with 16 MB of video frame buffer. Details are provided in the following table:

Table 11. Video specificationsVideo specifications
Resolution	Refresh rate (Hz)	Color depth (bits)
1024 x 768	60	8, 16, 32
1280 x 800	60	8, 16, 32
1280 x 1024	60	8, 16, 32
1360 x 768	60	8, 16, 32
1440 x 900	60	8, 16, 32
1600 x 900	60	8, 16, 32
1600 x 1200	60	8, 16, 32
1680 x 1050	60	8, 16, 32
1920 x 1080	60	8, 16, 32
1920 x 1200	60	8, 16, 32

Environmental specifications

NOTE:For additional information about environmental certifications, see the product environmental datasheet that is located with the Manuals & Documents on Dell Support.

The following table provides information for operational climatic range, category A2:

Table 12. Operational climatic rangeOperational climatic range.
Temperature	Specifications
Allowable continuous operations
Temperature ranges for altitudes <= 900 m (<= 2,953 ft)	10–35°C (50–95°F) with no direct sunlight on the equipment
Humidity percent ranges (non-condensing at all times)	8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point
Operational altitude de-rating	Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)

The following table provides information for shared requirements across all categories:

Table 13. Shared requirementsShared requirements.
Temperature	Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both operation and non-operation)	20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape NOTE:Per ASHRAE thermal guidelines for tape hardware, these are not instantaneous rates of temperature change.
Non-operational temperature limits	-40 to 65°C (-40 to 149°F)
Non-operational humidity limits	5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude	12,000 meters (39,370 feet)
Maximum operational altitude	3,048 meters (10,000 feet)

The following table specifies the maximum allowed vibration:

Table 14. Maximum allowed vibration Maximum allowed vibration.
Maximum vibration	Specifications
Operating	0.26 G_rms at 5 Hz to 350 Hz (all operation orientations)
Storage	1.88 G_rms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

The following table specifies the shock pulse maxima:

Table 15. Shock pulse maximaShock pulse maxima.
Maximum shock pulse	Specifications
Operating	Six consecutively executed shock pulses in the positive and negative x, y, and z axis of 6 G for up to 11 ms
Storage	Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on each side of the system) of 71 G for up to 2 ms

Particulate and gaseous contamination specifications

This section defines the limitations that prevent damage to the IT equipment from particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.

The following table contains particulate contamination specifications:

Table 16. Particulate contamination specificationsParticulate contamination specifications.
Particulate contamination	Specifications
Air filtration	Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust	Air must be free of conductive dust, zinc whiskers, or other conductive particles. This condition applies to data center and non-data center environments.
Corrosive dust	Air must be free of corrosive dust. Residual dust present in the air must have a deliquescent point less than 60% relative humidity. This condition applies to data center and non-data center environments.

The following table contains gaseous contamination specifications:

Table 17. Gaseous contamination specificationsGaseous contamination specifications.
Gaseous contamination	Specifications
Copper Coupon Corrosion rate	<300 Å/month per Class G1 as defined by ANSI/ ISA71.04-2013
Silver Coupon Corrosion rate	<200 Å/month as defined by ANSI/ISA71.04-2013

Thermal restrictions

The following table provides the thermal restriction matrix for processors and fans.

Table 18. Thermal restriction matrixThermal restriction matrix.
Configuration / Processor TDP	4 x 3.5-inch configuration	8 x 2.5-inch SAS/SATA configuration	Maximum Ambient Temperature
Rear Storage	Rear 3 LP	Rear 3 LP	N/A
105 W	STD fan STD HSK	STD fan STD HSK	40°C
120 W	STD fan STD HSK	STD fan STD HSK	40°C
135 W	STD fan STD HSK	STD fan STD HSK	40°C
150 W	STD fan STD HSK	STD fan STD HSK	40°C
165 W	STD fan STD HSK	STD fan STD HSK	35°C
165 W 8 cores, 3.6 GHz	HPR (SLVR) fan HPR HSK	HPR (SLVR) fan HPR HSK	35°C
185 W / 190 W	HPR (SLVR) fan HPR HSK	HPR (SLVR) fan HPR HSK	35°C

Processor blank is required for single processor configuration.

Two fan blanks are required to be installed on fan slot 1 and fan slot 2 for 5 fans configuration.

The following table provides label reference information:

Table 19. Label reference informationLabel reference information.
Label	Description
LP	Low Profile
HPR (SLVR)	High performance (silver grade)
HPR	High Performance
HSK	Heat sink

DIMM blank is not required.

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