Letter | Description |
---|---|
A | Smart fan (future expansion) |
B | SATA |
C | USB 2.0 dongle |
D | SATA |
E | DDR4 SO-DIMM |
F | PCIe x16 slot for PEG and SATA |
G | M.2 |
H | Wafer for reserved power of extensions |
I | USIM for M.2 |
J | USIM for Mini PCIe |
K | Mini PCIe |
L | Wafer for I2C sensor |
M | Wafer for speaker |
N | Wafer for COM x2 (optional), 8-ch DI, 8-ch DO, mic in and line out |
O | Wafer for COM x4 |
P | Wafer for I2C sensor |
Q | Internal power button |
R | PCIe x16 slot for PCIe and BP power |
S | RTC battery |
T | Board-to-Board for AFM board |
U | PWR for AFM MXM carrier board (12 V) |
V | Clear CMOS Jumper |