Dell APEX Cloud Platform MC-760 Hardware Requirements and Specifications

The information that is provided describes the thermal restrictions for the MC-760 system.

The following table provides information about the processor and heat sink matrix for the MC-760.

All GPU/FGPA cards require 1U L-type HSK and GPU shroud.

The following table provides information about the label reference for the MC-760.

The ambient temperature of the configuration is determined by the critical component in that configuration. For example, if the processor supports an ambient temperature of 35°C (95°F), the DIMM is 35°C (95°F), and the GPU is 30°C (86°F), the combined configuration can only support 30°C (86°F).

The following table provides information about the thermal restrictions matrix for air-cooled configuration for the MC-760.

_{*Supported ambient temperature is 30°C (86°F).}

The following table provides information about the thermal restriction matrix for memory with air-cooled configuration (non-GPU, 2.5-inch fans) for the MC-760.

In a 12 x 3.5-inch drive configuration with rear modules, CPU thermal design power (TDP) greater than 270 W and specific low temperature CPUs, are not supported.

The following table provides information about the thermal restriction matrix for rear NVMe drives with air-cooled configuration (non-GPU) for the MC-760.

The following table provides information about the thermal restriction matrix for GPU configurations for the MC-760.

The following table provides information about the thermal restrictions matrix for air-cooled configuration (GPU) for the MC-760.

The following table provides information about the thermal restriction matrix for memory with air-cooled configuration (GPU) for the MC-760.