The information that is provided describes the thermal restrictions for the
MC-760 system.
The following table provides information about the processor and heat sink matrix for the
MC-760.
Table 1. Processor and heat sink matrixThis table provides information about the processor and heat sink matrix for the
MC-760.
Heat sink
Processor TDP
STD HSK
≤ 165 W (supports only 2.5-inch drives and non-GPU configuration).
2U HPR HSK
125 W–250 W (supports 3.5-inch drives and non-GPU configuration).
165 W–350 W (supports 2.5-inch drives and non-GPU configuration).
L-type HSK
Supports all GPU and FPGA configurations
All GPU/FGPA cards require 1U L-type HSK and GPU shroud.
The following table provides information about the label reference for the
MC-760.
Table 2. Label referenceThis table provides information about the label reference for the
MC-760.
Label
Description
STD
Standard
HPR (Silver)
High Performance Silver (HPR) fan
HPR (Gold)
High Performance Gold (VHP) fan
HSK
Heat sink
LP
Low profile
FH
Full height
The ambient temperature of the configuration is determined by the critical component in that configuration. For example, if the processor supports an ambient temperature of 35°C (95°F), the DIMM is 35°C (95°F), and the GPU is 30°C (86°F), the combined configuration can only support 30°C (86°F).
The following table provides information about the thermal restrictions matrix for air-cooled configuration for the
MC-760.
Table 3. Thermal restriction matrix for air-cooled configuration (2.5-inch fans)This table provides information about the thermal restrictions matrix for air-cooled configuration for the
MC-760.
Configuration
24 x 2.5-inch SAS
24 x 2.5-inch NVMe
12 x 3.5-inch
Ambient temperature
Rear storage
No rear drives
4 x 2.5 in with rear fan
No rear drives
No rear drives
2.5-inch rear drives with rear fan
CPU TDP/cTDP
T-Case max center (°C)
Fan
HPR GOLD fan 70%
125 W
79
STD
HPR SLVR
HPR GOLD
HPR SLVR
HPR GOLD
35°C (95°F)
150 W
72, 78, or 79
STD
HPR SLVR
HPR GOLD
HPR SLVR
HPR GOLD
35°C (95°F)
165 W
82 or 84
STD
HPR SLVR
HPR GOLD
HPR SLVR
HPR GOLD
35°C (95°F)
185 W
80, 81, or 85
STD
HPR SLVR
HPR GOLD
HPR GOLD
HPR GOLD
35°C (95°F)
195 W
96
STD
HPR SLVR
HPR GOLD
HPR GOLD
HPR GOLD
35°C (95°F)
205 W
76, 84, or 85
STD
HPR SLVR
HPR GOLD
HPR GOLD
HPR GOLD
35°C (95°F)
225 W
79
STD
HPR SLVR
HPR GOLD
HPR GOLD*
HPR GOLD*
35°C (95°F)
250 W
76
STD
HPR SLVR
HPR GOLD
HPR GOLD
HPR GOLD
35°C (95°F)
270 W
71 or 75
HPR SLVR
HPR SLVR
HPR GOLD
N/S
N/S
N/S
300 W
75, 76, or 81
HPR SLVR
HPR SLVR
HPR GOLD
N/S
N/S
N/S
350 W
79
HPR SLVR
HPR SLVR
HPR GOLD fan*
N/S
N/S
N/S
350 W
57 or 66
N/S
N/S
N/S
N/S
N/S
N/S
*Supported ambient temperature is 30°C (86°F).
The following table provides information about the thermal restriction matrix for memory with air-cooled configuration (non-GPU, 2.5-inch fans) for the
MC-760.
Table 4. Thermal restriction matrix for memory with air-cooled configuration (non-GPU, 2.5 in fans)This table provides information about the thermal restriction matrix for memory with air-cooled configuration (non-GPU, 2.5-inch fans) for the
MC-760.
Configuration
No backplane
24 x 2.5-inch SAS
24 x 2.5-inch NVMe
12 x 3.5-inch
Rear storage
No rear drives
No rear drives
4 x 2.5-inch with rear fan
No rear drives
No rear drives
2.5-inch rear drives with rear fan
DIMM Configuration
2DPC/Power
STD fan (CPU TDP <= 250 W)
HPR SLVR fan (CPU TDP up to 350 W)
HPR GOLD fan (CPU TDP up to 350 W)
HPR GOLD fan 70% (CPU TDP up to 250 W)
256 GB RDIMM
12.7 W
30°C (86°F)
N/A
35°C (95°F)
N/A
N/A
N/A
128 GB RDIMM
8.9 W
35°C (95°F)
30°C (86°F)
35°C (95°F)
35°C (95°F)
30°C (86°F)
30°C (86°F)
64 GB RDIMM
6.9 W
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
30°C (86°F)
30°C (86°F)
32 GB RDIMM
4.1 W
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
16 GB RDIMM
3 W
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
DIMM Configuration
2DPC/Power
HPR SLVR fan (CPU TDP up to 350 W)
HPR GOLD fan (CPU TDP up to 350 W)
HPR GOLD fan 70% (CPU TDP up to 250 W)
256 GB RDIMM
12.7 W
30°C (86°F)
35°C (95°F)
35°C (95°F)
Not supported
Not supported
Not supported
128 GB RDIMM
8.9 W
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
30°C (86°F)
30°C (86°F)
64 GB RDIMM
6.9 W
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
30°C (86°F)
30°C (86°F)
32 GB RDIMM
4.1 W
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
16 GB RDIMM
3 W
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
35°C (95°F)
In a 12 x 3.5-inch drive configuration with rear modules, CPU thermal design power (TDP) greater than 270 W and specific low temperature CPUs, are not supported.
The following table provides information about the thermal restriction matrix for rear NVMe drives with air-cooled configuration (non-GPU) for the
MC-760.
Table 5. Thermal restriction matrix for rear NVMe drives with air-cooled configuration (non-GPU)This table provides information about the thermal restriction matrix for rear NVMe drives with air-cooled configuration (non-GPU) for the
MC-760.
Configuration
24 x 2.5 in SAS
12 x 3.5 in
Rear storage
4 x 2.5 in with rear fan
4 x 2.5 in with rear fan
Drive type
Drives capacity
Power
HPR SLVR fan
HPR GOLD fan 70%
Kioxia CD7
15.36 TB
19 W
35°C (95°F)
30°C (86°F)
Samsung PM9A3
7.68 TB
14 W
35°C (95°F)
30°C (86°F)
Samsung PM1733
15.36 TB
22 W
30°C (86°F)
30°C (86°F)
Samsung PM1733a
15.36 TB
19.7 W
30°C (86°F)
N/A
Samsung PM1735a
12.8 TB
19.8 W
30°C (86°F)
N/A
Intel P5520
15.36 TB
20 W
35°C (95°F)
35°C (95°F)
The following table provides information about the thermal restriction matrix for GPU configurations for the
MC-760.
Table 6. Thermal restriction matrix for GPU configurationsThis table provides information about the thermal restriction matrix for GPU configurations for the
MC-760.
Configuration
No backplane
24 x 2.5 in SAS
24 x 2.5 in NVMe
Rear storage
No rear drives
No rear drives
No rear drives
CPU TDP/cTDP
T-Case max center (°C)
HPR GOLD fan with 1U HPR L-Type HSK
125 W
79
35°C (95°F)
35°C (95°F)
35°C (95°F)
150 W
72, 78, or 79
35°C (95°F)
35°C (95°F)
35°C (95°F)
165 W
82 or 84
35°C (95°F)
35°C (95°F)
35°C (95°F)
185 W
80, 81, or 85
35°C (95°F)
35°C (95°F)
35°C (95°F)
195 W
96
35°C (95°F)
30°C (86°F)
30°C (86°F)
205 W
76, 84, or 85
35°C (95°F)
35°C (95°F)
35°C (95°F)
225 W
79
35°C (95°F)
35°C (95°F)
35°C (95°F)
250 W
76
35°C (95°F)
35°C (95°F)
35°C (95°F)
270 W
75
35°C (95°F)
35°C (95°F)
35°C (95°F)
270 W
71
35°C (95°F)
30°C (86°F)
30°C (86°F)
300 W
75, 76, or 81
35°C (95°F)
30°C (86°F)
30°C (86°F)
350 W
79
30°C (86°F)
Not supported
Not supported
350 W
57 or 66
Not supported
Not supported
Not supported
The following table provides information about the thermal restrictions matrix for air-cooled configuration (GPU) for the
MC-760.
Table 7. Thermal restrictions matrix for air-cooled configuration (GPU)This table provides information about the thermal restrictions matrix for air-cooled configuration (GPU) for the
MC-760.
Configuration
24 x 2.5 in SAS
24 x 2.5 in NVMe
Rear storage
No rear drives
No rear drives
GPU
HPR GOLD fan with 1U HPR L-Type HSK
A40 (Max 2)
30°C (86°F)
30°C (86°F)
A100 80 GB (Max 2)
35°C (95°F)
35°C (95°F)
A16 (Max 2)
35°C (95°F)
35°C (95°F)
A30 (Max 2)
35°C (95°F)
35°C (95°F)
A2 (Max 6)
35°C (95°F)
35°C (95°F)
H100 (Max 2)
35°C (95°F)
35°C (95°F)
A800 (Max 2)
35°C (95°F)
35°C (95°F)
L40S (Max 2)
35°C (95°F)
35°C (95°F)
The following table provides information about the thermal restriction matrix for memory with air-cooled configuration (GPU) for the
MC-760.
Table 8. Thermal restriction matrix for memory with air-cooled configuration (GPU)This table provides information about the thermal restriction matrix for memory with air-cooled configuration (GPU) for the
MC-760.
Configuration
No backplane
24 x 2.5 in SAS
24 x 2.5 in NVMe*
DIMM configuration
2DPC/Power
HPR GOLD fan with 1U HPR L-Type HSK
256 GB RDIMM
12.7 W
30°C (86°F)
Required DLC
Required DLC
128 GB RDIMM
8.9 W
35°C (95°F)
35°C (95°F)
35°C (95°F)
64 GB RDIMM
6.9 W
35°C (95°F)
35°C (95°F)
35°C (95°F)
32 GB RDIMM
4.1 W
35°C (95°F)
35°C (95°F)
35°C (95°F)
16 GB RDIMM
3 W
35°C (95°F)
35°C (95°F)
35°C (95°F)
* In 24 x 2.5-in NVMe configuration, for CPU TDP 270 W - 300 W and specific Low Temperature-case CPUs, the supported ambient temperature is 30°C (86°F).
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