Dell APEX Cloud Platform MC-660 Hardware Requirements and Specifications

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Thermal restriction matrix

The following information describes the thermal restrictions for the MC-660 and is applicable, except where indicated, for the Dell APEX Cloud Platform offerings:

The following table provides the processor and heat sink matrix for the MC-660.

Table 1. Processor and heat sink matrixThis table provides the processor and heat sink matrix for the MC-660.
Heat sink	Processor TDP
STD HSK	≤ 185 W
L-type HSK	> 185 W

The following table provides the label references for the MC-660.

Table 2. Label referenceThis table provides the label references for the MC-660.
Label	Description
STD	Standard
HPR (Gold)	High performance (gold grade)
HSK	Heat sink
LP	Low profile
FH	Full height

The following table provides the thermal restriction matrix for an air-cooled configuration for the MC-660 with APEX Cloud Platform for Microsoft Azure.

Table 3. Thermal restriction matrix for air-cooled configurationThis table provides the thermal restriction matrix for an air-cooled configuration for the MC-660 with APEX Cloud Platform for Microsoft Azure.
Configuration		10 x 2.5-inch SAS	10 x 2.5-inch NVMe	Ambient temperature
CPU TDP/cTDP	T-Case maximum center (°C)	Fan		Ambient temperature
125 W	79°C (174.2°F)	HPR Gold	HPR Gold	35°C (95°F)
150 W	78°C (172.4°F)/79°C (174.2°F)	HPR Gold	HPR Gold	35°C (95°F)
165 W	82°C (179.6°F)/84°C (183.2°F)	HPR Gold	HPR Gold	35°C (95°F)
185 W	80°C (176°F)/81°C (177.8°F)/85°C (185°F)	HPR Gold	HPR Gold	35°C (95°F)
195 W	64°C (147.2°F)	HPR Gold	HPR Gold	35°C (95°F)
205 W	76°C (168.8°F) 84°C (183.2°F) 85°C (185°F)	HPR Gold	HPR Gold	35°C (95°F)
225 W	79°C (174.2°F)	HPR Gold	HPR Gold	35°C (95°F)
250 W	76°C (172.4°F)	HPR Gold	HPR Gold	35°C (95°F)
270 W	75°C (167°F)	HPR Gold*	HPR Gold*	35°C (95°F)
270 W	71°C (159.8°F)	HPR Gold*	HPR Gold*	35°C (95°F)
300 W	81°C (177.8°F)	N/S	N/S	35°C (95°F)
300 W	76°C (172.4°F)	N/S	N/S	35°C (95°F)
300 W	77°C (170.6°F)	N/S	N/S	35°C (95°F)
300 W	75°C (172.4°F)	N/S	N/S	35°C (95°F)
300 W	76°C (172.4°F)	N/S	N/S	35°C (95°F)
330 W	77°C (170.6°F)	N/S	N/S	N/A
350 W	79°C (174.2°F)	N/S	N/S	N/A
350 W	78°C (172.4°F)	N/S	N/S	N/A

^{*Supported ambient temperature is 30°C (86°F).}

The following table provides the thermal restrictions for memory for the MC-660 with APEX Cloud Platform for Microsoft Azure.

Table 4. Thermal restriction for memoryThis table provides the thermal restrictions for memory for the MC-660 with APEX Cloud Platform for Microsoft Azure.
Configuration		10 x 2.5-inch SAS	10 x 2.5-inch NVMe
256 GB RDIMM		30°C (86°F) NOTE:30°C (86°F) for CPU>225 W (CPU<=225 W could support 35°C (95°F) )	30°C (86°F) NOTE:30°C (86°F) for CPU>225 W (CPU<=225 W could support 35°C (95°F) )

Install all fan modules for a single CPU configuration and consider the following:

All air-cooling configurations require a CPU shroud.
For APEX Cloud Platform for Microsoft Azure, install the PCH shroud for a no riser configuration.
For APEX Cloud Platform for Microsoft Azure, install the rear drive shroud for air-cooling with a 2 x 2.5-inch rear drive configuration.
Install A2 blank on R1p riser for FH riser configuration with A2 GPU.
Install DIMM blanks in all empty DIMM slots for STD CPU heat sink or CPU TDP >=250 W.

The following table provides the thermal restriction matrix for an air-cooled configuration for the MC-660:

APEX Cloud Platform for Red Hat OpenShift

Table 5. Thermal restriction matrix for air cooled configurationThis table provides the thermal restriction matrix for an air-cooled configuration for the MC-660.
Configuration		10 x 2.5-inch SAS/SATA	10 x 2.5-inch NVMe	Ambient temperature
CPU TDP/cTDP	T-Case maximum center (°C)	Fan		Ambient temperature
125 W	79°C (174.2°F)	STD	STD	35°C (95°F)
150 W	78°C (172.4°F)/79°C (174.2°F)	STD	STD	35°C (95°F)
165 W	82°C (179.6°F)/84°C (183.2°F)	STD	STD	35°C (95°F)
185 W	80°C (176°F)/81°C (177.8°F)/85°C (185°F)	STD	STD	35°C (95°F)
195 W	64°C (147.2°F)	HPR Gold	HPR Gold	35°C (95°F)
205 W	76°C (168.8°F) 84°C (183.2°F) 85°C (185°F)	HPR Gold	HPR Gold	35°C (95°F)
225 W	79°C (174.2°F)	HPR Gold	HPR Gold	35°C (95°F)
250 W	76°C (172.4°F)	HPR Gold	HPR Gold	35°C (95°F)
270 W	75°C (167°F)	HPR Gold	HPR Gold	35°C (95°F)
270 W	71°C (159.8°F)	HPR Gold	HPR Gold	35°C (95°F)
300 W	81°C (177.8°F)	HPR Gold*	HPR Gold*	35°C (95°F)
300 W	76°C (172.4°F)	HPR Gold*	HPR Gold*	35°C (95°F)
300 W	77°C (170.6°F)	HPR Gold*	HPR Gold*	35°C (95°F)
300 W	75°C (172.4°F)	HPR Gold*	HPR Gold*	35°C (95°F)
300 W	76°C (172.4°F)	HPR Gold*	HPR Gold*	35°C (95°F)
330 W	77°C (170.6°F)	N/S	N/S	N/A
350 W	79°C (174.2°F)	N/S	N/S	N/A
350 W	78°C (172.4°F)	N/S	N/S	N/A

^{*Supported ambient temperature is 30°C (86°F).}

The following table provides the thermal restrictions for memory for the MC-660 with:

APEX Cloud Platform for Red Hat OpenShift

Table 6. Thermal restriction for memoryThis table provides the thermal restrictions for memory for the MC-660.
Configuration		10 x 2.5-inch SAS/SATA	10 x 2.5-inch NVMe
256 GB RDIMM		30°C (86°F) NOTE:30°C (86°F) for CPU > 250 W (CPU ≤ 250 W could support 35°C (95°F) )	30°C (86°F) NOTE:30°C (86°F) for CPU > 250 W (CPU ≤ 250 W could support 35°C (95°F) )

Install all fan modules for a single CPU configuration and consider the following:

All air-cooling configurations require a CPU shroud.
Install A2 blank on R1p riser for FH riser configuration with A2 GPU.
Install DIMM blanks in all empty DIMM slots for STD CPU heat sink or CPU TDP >=250 W.

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Dell APEX Cloud Platform MC-660 Hardware Requirements and Specifications

Thermal restriction matrix

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