Dell VxRail™ E660, E660F, and E660N Technical Specifications

Thermal restrictions matrix for air cooling

The following table describes the label references that are used in the thermal restriction tables:


Label references
STD	Standard
HPR	High Performance
HSK	Heat sink
LP	Low Profile (Riser)
FH	Full Height (Riser)
DW	Double Wide (Xilinx FPGA accelerator)
BPS	Intel Persistent Memory 200 series (BPS)

The following table describes the system details of VxRail E660 and E660F:


Configuration		CPU (TDP)	DIMM (RDIMM/LRDIMM/BPS)	Fan/Quantity	Heatsinks	Air shroud	DIMM blank
Front storage		CPU (TDP)	DIMM (RDIMM/LRDIMM/BPS)	Fan/Quantity	Heatsinks	Air shroud	DIMM blank
10 x 2.5" HDD	Any PPCM config	<=165W	All types of DIMM (Except BPS)	HPR Silver fan with qty 4(2S)/3 (1S)	Standard Heatsink	Yes	Yes
		>165W to <220W		HPR Silver fan with qty 4(2S)/3 (1S)	Extended Heatsink	No	No
		>=220W		HPR Gold fan with qty 4 (2S)/3(1S)	Extended Heatsink	No	No
	GPU	Depends on CPU TDP	All types of DIMM	HPR Gold fan with qty 4(2S)/3(1S)	Extended Heatsink	No	No

The following table describes the ASHRAE A2/35°C thermal restrictions for CPU and 128 GB LRDIMM of VxRail E660 and E660F:


Ambient Support Matrix for ICX CPU and 128 GB LRDIMM
Configuration		10 x 2.5-inch 3 LP/ 2 FH
CPU TDP	105 W/120 W	HPR Silver fan Supports at 35°C.
	125 W/135 W
	150 W
	165 W
	185 W
	205 W
	220 W	HPR Gold fan Supports at 35°C.
	250 W
	270 W
Memory	64 GB RDIMM	Supports at 35°C.
Memory	128 GB LRDIMM	Supports at 35°C.

The following table describes the ASHRAE A2/35°C thermal restrictions for T4 GPU and 128 GB LRDIMM of VxRail E660 and E660F:


Ambient Support Matrix for ICX CPU and 128 GB LRDIMM
Configuration		10 x 2.5-inch 3 LP/ 2 FH
CPU TDP	105 W / 120 W	HPR Gold fan Supports at 35°C.
	125 W / 135 W
	150 W
	165 W
	185 W
	205 W
	220 W
	250 W
	270 W
Memory	64 GB RDIMM	Supports at 35°C.
Memory	128 GB LRDIMM	Not supported at 35°C environment if CPU TDP > 205 W (See 30°C thermal restriction for 10 x 2.5-inch configuration table)

The following table describes the ASHRAE A2/35°C thermal restrictions for BPS memory of VxRail E660 and E660F:


Ambient Support Matrix for ICX CPU and 128 GB LRDIMM
Configuration		10 x 2.5-inch 3 LP/ 2 FH
CPU TDP	105 W/120 W	HPR Gold fan Supports at 35°C.
	125 W/135 W
	150 W
	165 W
	185 W
	205 W
	220 W
	250 W
	270 W
Memory	BPS + 64 GB RDIMM
Memory	BPS + 128 GB LRDIMM	Not supported if CPU TDP > 165 W Supports at 35°C.
T4 GPU	165 W	HPR Gold fan Supports at 35°C.
	220 W
	250 W
	270 W

The following table describes the 30°C thermal restrictions of 10 x 2.5-inch configuration:


Ambient Support Matrix for ICX CPU and 128 GB LRDIMM
Configuration		10 x 2.5-inch 3 LP/ 2 FH
64 GB RDIMM / 128 GB LRDIMM, BPS, and T4 GPU	64 GB RDIMM	Supported at 35°C: All CPU TDP up to 270 W
	128 GB LRDIMM
	T4 + 64 GB RDIMM
	T4 + 128 GB LRDIMM	Supported at 30°C: CPU TDP 220 W-270 W
	BPS + 64 GB RDIMM	Supported at 30°C: CPU TDP 270 W
	BPS + 128 GB LRDIMM	Supported at 30°C: CPU TDP 185 W-270 W
	T4 + BPS + 64 GB RDIMM	Supported at 30°C: CPU TDP 270 W
	T4 + BPS + 128 GB LRDIMM	Supported at 30°C: CPU TDP 185 W-270 W

The following table describes the system details of VxRail E660N:


Configuration		CPU (TDP)	DIMM (RDIMM/LRDIMM/BPS)	Fan	Heatsinks	Air shroud	DIMM blank
Front storage		CPU (TDP)	DIMM (RDIMM/LRDIMM/BPS)	Fan	Heatsinks	Air shroud	DIMM blank
10 x 2.5" NVMe	Any PPCM config	<=165W	All types of DIMM	HPR Gold fan (VHP)	Standard Heatsink	Yes	Yes
		>165W to <220W			Extended Heatsink	No	No
		>=220W			Extended Heatsink	No	No
	GPU	Depends on CPU TDP	All types of DIMM		Extended Heatsink	No	No

The following table describes the ASHRAE A2/35°C thermal restrictions for CPU and 128 GB LRDIMM of VxRail E660N:


Ambient Support Matrix for ICX CPU and 128 GB LRDIMM
Configuration		10 x 2.5-inch 3 LP/ 2 FH
CPU TDP	105 W/120 W	HPR Gold fan Supports at 35°C.
	125 W/135 W
	150 W
	165 W
	185 W
	205 W
	220 W
	250 W
	270 W
Memory	64 GB RDIMM	HPR Gold fan Supports at 35°C.
Memory	128 GB LRDIMM	HPR Gold fan Supports at 35°C.

The following table describes the ASHRAE A2/35°C thermal restrictions for CPU and 256 GB LRDIMM of VxRail E660N:


Ambient Support Matrix for ICX CPU and 256 GB LRDIMM
Configuration		10 x 2.5-inch HDD front storage
CPU TDP	105 W/120 W	HPR Gold fan Supports at 35°C.
	125 W/135 W
	150 W
	165 W
	185 W	Not supported Supports at 35°C.
	205 W
	220 W
	250 W
	270 W
Memory	256 GB LRDIMM	Not supported if CPU TDP > 165 W Supports at 35°C.

NOTE:

The following table describes the ASHRAE A2/35°C thermal restrictions for T4 GPU and 128 GB LRDIMM of VxRail E660N:


Ambient Support Matrix for ICX CPU and 128 GB LRDIMM
Configuration		10 x 2.5-inch 3 LP/ 2 FH
CPU TDP	105 W / 120 W	HPR Gold fan Supports at 35°C.
	125 W / 135 W
	150 W
	165 W
	185 W
	205 W
	220 W
	250 W
	270 W
Memory	64 GB RDIMM	Supports at 35°C.
Memory	128 GB LRDIMM	Not supported at 35°C environment if CPU TDP > 205 W (See 30°C thermal restriction for 10 x 2.5-inch configuration table)

The following table describes the ASHRAE A2/35°C thermal restrictions for BPS memory of VxRail E660N:


Ambient Support Matrix for ICX CPU and 128 GB LRDIMM
Configuration		10 x 2.5-inch 3 LP/ 2 FH
CPU TDP	105 W / 120 W	HPR Gold fan Supports at 35°C.
	125 W / 135 W
	150 W
	165 W
	185 W
	205 W
	220 W
	250 W
	270 W
Memory	BPS + 64 GB RDIMM
Memory	BPS + 128 GB/256 GB LRDIMM	Not supported if CPU TDP > 165 W Supports at 35°C.
T4 GPU	165 W	HPR Gold fan Supports at 35°C.
	220 W
	250 W
	265 W / 270 W	Not supported

The following table describes the 30°C thermal restrictions of 10 x 2.5-inch configuration:


Ambient Support Matrix for ICX CPU and 128 GB LRDIMM
Configuration		10 x 2.5-inch 3 LP/ 2 FH
64 GB RDIMM / 128 GB LRDIMM, BPS, and T4 GPU	64 GB RDIMM	Supported at 35°C: All CPU TDP up to 270 W
	128 GB LRDIMM
	T4 + 64 GB RDIMM
	T4 + 128 GB LRDIMM	Supported at 30°C: CPU TDP 210 W-270 W
	BPS + 64 GB RDIMM	Supported at 30°C: CPU TDP 260 W-270 W
	BPS + 128 GB LRDIMM	Supported at 30°C: CPU TDP 185 W-270 W
	T4 + BPS + 64 GB RDIMM	Supported at 30°C: CPU TDP 260 W-270 W
	T4 + BPS + 128 GB LRDIMM	Supported at 30°C: CPU TDP 185 W-270 W