Prerequisites
CAUTION: If you are using the Trusted Platform Module (TPM) with an encryption key, you may be prompted to create a recovery key during program or System Setup. Be sure to create and safely store this recovery key. If you replace this system board, you must supply the recovery key when you restart your system or program before you can access the encrypted data on your drives.
Follow the safety guidelines listed in the Safety instructions.
Follow the procedure listed in the Before working inside your system
Power off the system and all attached peripherals.
Disconnect the system from the electrical outlet and disconnect the peripherals.
If applicable, remove the system from the rack.
Remove the system cover.
Remove the following components:
a. Air shroud:
Hold the edges of the air shroud, and lift the air shroud out of the system.
NOTE: Air shroud is not supported for T-type heat sink and liquid cooling configurations.
For the air shroud on the rear drive module, hold the edges of the air shroud, and lift the air shroud out of the rear drive module.
b. Removing a cooling fan module:
Holding the orange and black edges on the fan module, lift the cooling fan module to disconnect from the connector on the system board.
NOTE: The procedure to remove standard (STD), high performance silver grade (HPR SLVR), or high performance gold grade (HPR Gold) dual cooling fan modules are same.
WARNING: Ensure not to tilt or rotate the cooling fan module while removing from the system.
c. Removing the processor and heat sink module:
Ensure all four anti-tilt wires are in the locked position (outward position),using a Torx #T30 screwdriver, loosen the captive screws on the PHM n the order below:
a. Loosen the first screw three turns.
b. Loosen the screw diagonally opposite to the screw you loosened first.
c. Repeat the procedure for the remaining two screws.
d. Return to the first screw and loosen it completely.
Set all the anti-tilt wires to unlocked position (inward position).
Lift the PHM from the system and set the PHM aside with the processor side facing up.
d. Removing a memory module:
Locate the appropriate memory module socket.
To release the memory module from the socket, simultaneously press the ejectors on both ends of the memory module socket to fully open.
CAUTION: Handle each memory module only by the card edges, ensuring not to touch the middle of the memory module or metallic contacts.
Lift the memory module away from the system.
e. Removing the expansion card risers:
For Riser 1, press the blue tab and holding the edges lift the expansion card riser from the riser connector on the system board.
For Riser 2 and liquid cooling Riser 2, press the blue button on the riser, and holding the touch points lift the expansion card riser from the riser connector on the system board.
For Riser 3 and liquid cooling Riser 3, press the blue button on the riser, and lift the expansion card riser from the riser connector on the system board.
For Riser 4, press the blue tab on the riser, and holding the touch point lift the expansion card riser from the riser connector on the system board.
f. Removing the IDSDM module (if installed):
Holding the blue pull tab, lift the IDSDM module out of the system.
g. Removing the optional internal USB card (if installed):
Holding the blue tag, lift the internal USB card to disconnect from the connector on the system board.
Remove the USB memory key from the internal USB card.
h. Removing the OCP card (if installed):
Open the blue latch to unlock the OCP card.
Push the OCP card towards the rear end of the system to disconnect from the connector on the system board and slide the OCP card out of the slot on the system.
i. Removing a power supply unit:
Press the release latch, and holding the PSU handle slide the PSU out of the PSU bay.
j. Disconnect all cables from the system board.
CAUTION: Take care not to damage the system identification button while removing the system board from the system.
Removing the system board:
Using the system board holder and plunger, slide the system board towards the front of the system.
Lift the system board out of the chassis.
Installing the system board:
Unpack the new system board assembly.
CAUTION: Do not lift the system board by holding a memory module, processor, or other components.
CAUTION: Take care not to damage the system identification button while placing the system board into the chassis.
Holding the system board holder and plunger, lower the system board into the system.
Slide the system board towards the rear of the chassis until the connectors are firmly seated in the slots.
Replace the following components:
a. Upgrading the Trusted Platform Module
Removing the TPM:
Locate the TPM connector on the system board. For more information, see System board connectors.
Press to hold the module down and remove the screw using the security Torx 8-bit shipped with the TPM module.
Slide the TPM module out from its connector.
Push the plastic rivet away from the TPM connector and rotate it 90° counterclockwise to release it from the system board.
Pull the plastic rivet out of its slot on the system board.
Installing the TPM:
To install the TPM, align the edge connectors on the TPM with the slot on the TPM connector.
Insert the TPM into the TPM connector such that the plastic rivet aligns with the slot on the system board.
Press the plastic rivet until the rivet snaps into place.
Replace the screw that secures the TPM to the system board.
NOTE: The TPM Module must be replaced only while installing new system board.
Installing the IDSDM module (if installed):
Locate the IDSDM connector on the system board.
To locate IDSDM module, see the System board jumpers and connectors section.
Align IDSDM module with the connector on the system board.
Press the IDSDM module until it is firmly seated in the connector on the system board.
Installing Internal USB card (if installed):
Connect the USB key to the internal USB card.
Align the internal USB card with the connector on the system board and press firmly until the internal USB card is seated.
Installing a power supply unit:
Slide the PSU into the PSU bay until the release latch snaps into place.
Installing the OCP card (if installed):
Open the blue latch on the system board.
Slide the OCP card into the slot in the system.
Push until the OCP card is connected to the connector on the system board.
Close the latch to lock the OCP card to the system.
Installing the processor heat sink module:
Set the anti-tilt wires to the unlocked position on the heat sink (inward position).
Align the pin 1 indicator of the heat sink to the system board, and then place the processor and heat sink on the processor socket.
CAUTION: To avoid damaging the fins on the heat sink, do not press down on the heat sink fins.
NOTE: Ensure the heat sink is held parallel to the system board to prevent damaging the components.
Set the anti-tilt wires to the locked position (outward position), and then using the Torx #T30 screwdriver, tighten the screws (8 in-lbf) on the heat sink in the below sequence:
a. Tighten the first screw three turns.
b. Tighten the screw diagonally opposite to the screw you tighten first.
c. Repeat the procedure for the remaining two screws.
d. Return to the first screw to tighten it completely.
Installing a memory module:
Locate the appropriate memory module socket.
CAUTION: Handle each memory module only by the card edges, ensuring not to touch the middle of the memory module or metallic contacts.
If a memory module is installed in the socket, remove it.
NOTE: Ensure the socket ejector latches are fully open, before installing the memory module.
Align the edge connector of the memory module with the alignment key of the memory module socket, and insert the memory module in the socket.
CAUTION: To prevent damage to the memory module or the memory module socket during installation, do not bend or flex the memory module; insert both ends of the memory module simultaneously.
NOTE: The memory module socket has an alignment key that enables you to install the memory module in the socket in only one orientation.
CAUTION: Do not apply pressure at the center of the memory module; apply pressure at both ends of the memory module evenly.
Press the memory module with your thumbs until the ejectors firmly click into place. When the memory module is properly seated in the socket, the levers on the memory module socket align with the levers on the other sockets that have memory modules installed.
Installing a cooling fan module:
Align and place the fan module connector horizontally with the connector on the system board.
NOTE: The procedure to remove standard (STD), high performance silver grade (HPR SLVR), or high performance gold grade (HPR Gold) dual cooling fan modules are same.
Press the touch point on the cooling fan module until firmly connected.
Installing the air shroud:
Holding the edges of the air shroud, align the slot on the air shroud with the standoff on the system.
Lower the air shroud into the system until it is firmly seated.
NOTE: Air shroud is not supported for T-type heat sink and liquid cooling configurations.
For the air shroud on the rear drive module, lower the air shroud into the rear drive module until it is firmly seated.
Reconnect all cables to the system board.
NOTE: Ensure that the cables inside the system are routed along the chassis wall and secured using the cable securing bracket.
Ensure that you perform the following steps:
Use the Easy Restore feature to restore the Service Tag. See the Restoring the system by using the Easy Restore feature section.
If the service tag is not backed up in the backup flash device, enter the system service tag manually. See the Manually update the Service Tag by using System Setup section.
Update the BIOS and iDRAC versions.
Reenable the Trusted Platform Module (TPM). See the Upgrading the Trusted Platform Module section.
If you are not using Easy restore, import your new or existing iDRAC Enterprise license.
Replace the system cover.
If applicable, install the system into the rack.
Reconnect the peripherals and connect the system to the electrical outlet, and then power on the system.
